To enhance adhesion! Use neutral bath pure gold plating for gold plating.
We would like to introduce the "plating with bonding properties" that we handle. In plating with bonding properties, gold and silver plating are used. In particular, neutral bath pure gold plating is used for gold plating. Plating is applied to the parts where bonding occurs, specifically on the electrode parts of semiconductor devices and package leads, to enhance joint compatibility. Please feel free to contact us if you have any requests. 【Typical composition of neutral bath (partial)】 ■ Gold compound (metal salt): Potassium cyanide ■ Gold concentration: 8–10 ■ Conductive salt/acid: Citrate/phosphate ■ pH: 6–7 ■ Added metals: As or Ta *For more details, please download the PDF or feel free to contact us.
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【Other representative neutral bath liquid compositions】 ■Temperature (°C): 60-70 ■Purity (%): 99.9-99.99 ■Hardness (Hv): 80-100 *For more details, please download the PDF or feel free to contact us.
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Our company performs plating processes for chip resistors, connectors, and ceramic substrates for LEDs. As a result of our aim to be a trusted and necessary company that responds to any changes in our customers' needs, we receive requests for world-class products. From the field of surface treatment, we strive to be a company that supports the electronic components industry, including automotive and semiconductors, prioritizing the trust of our customers, maintaining a spirit of challenge, and working hard to continue growing.