Removal of resins such as epoxy and silicone adhered to semiconductor packaging molds.
Decompression boiling ultrasonic cleaning machine Hagitori
Playing a role in quality control of semiconductor packaging! Removing only dirt without damaging the mold!
A cleaning machine called "Hagitori" that can clean and remove thermosetting resins (such as epoxy, silicone, and urethane) adhered to essential encapsulation molds in semiconductor manufacturing without damaging the molds, and can wash and remove multiple pieces at once. - Significantly reduces cleaning time - Reduces maintenance frequency - Lowers maintenance costs This can also lead to improved productivity.
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basic information
Cleaning test now accepting applications!
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Leave it to us for resin clogged in semiconductor encapsulation molds, molding machine nozzles, and breaker plates!
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Company information
【Business Content】 - Mold cleaning machines - Mold cleaning machines for optical components - Mold temperature control piping cleaning machines - Welding machines for mold repair - Special cleaning solutions We conduct all research, development, manufacturing, and sales of mold maintenance equipment in-house. Our products solve the challenges faced in the field of mold maintenance. 【Our Strengths】 - Over 30 years of research in mold maintenance - 32% market share in the industry, with a cumulative sales record of over 8,000 units Awarded the "Osaka Manufacturing Excellent Company Award 2022." Recognized as a company that has made a significant impact on traditional mold maintenance methods with our world-first unique cleaning solutions.