Technical Data Presentation: CAM Joining Enabled by Low Thermal Resistance for Dissimilar Material Bonding
Joining of dissimilar materials such as metal, resin, and ceramics is possible! Improving heat dissipation properties is becoming increasingly important. The bonding strength is secured at over 10 MPa in shear tensile tests.
Our company conducts test processing, specialized CAM agents, and process development using CAM bonding technology. This bonding technology combines chemical bonding and fusion. It is environmentally friendly, allows for easy construction, and can reduce costs. CAM agents are applied and dried on metal surfaces to form an organic film, which is then bonded to the workpieces through thermal pressing. You can read the technical documentation that describes detailed features and functions. 【Examples of bondable materials】 ■ Metals: Aluminum, Copper, Steel, Titanium ■ Resins: Nylon, PBT, CFRP ■ Ceramics: Alumina, Glass ■ Zero thermal resistance is also possible.
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【Features of Low Thermal Resistance CAM Agents】 ■M8.xx: Water-soluble, conductive ■G4.xx: Non-water-soluble, insulating, transparent ■Q1.xx: Non-water-soluble, conductive ■Q3.xx: Non-water-soluble, insulating ■Q5.xx: Non-water-soluble, insulating, inexpensive *For more details, please feel free to contact us.
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Our company is engaged in the development of joining technologies. The newly developed CAM joining can handle a range of applications, starting from the joining of dissimilar materials such as metal and resin, to metal-metal joining that includes dissimilar metals. CAM joining can achieve zero thermal resistance and is also applicable to the laminated joining of multilayer thin plates.