A thermal conductivity that is 6 times or 10 times that of the general FR-4 type.
Glass fabric substrate epoxy resin printed circuit board materials are referred to as FR-4 in the industry. The thermal conductivity of standard FR-4 is about 0.3 W/mK. In contrast, Risholite high thermal conductivity FR-4 offers a lineup with thermal conductivities of 1.8 W/mK, which is six times that of standard products, and 3 W/mK, which is ten times higher. Since heat dissipation substrates can be manufactured using existing equipment, we have received many adoptions.
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basic information
High thermal conductivity printed circuit board materials feature an insulating layer arranged on the surface of aluminum or copper plates, which possess excellent thermal conductivity, with copper foil for circuit formation placed on top. There are also materials based on ceramics, which tend to be quite expensive. There are high thermal conductivity materials available in glass epoxy, but the mainstream type is called CEM-3, which consists of glass non-woven fabric sandwiched between glass cloth, and naturally has a thickness of about 1mm. In contrast, the high thermal conductivity material from Risholite is of the FR-4 type, made solely of glass cloth, allowing for a thickness of just 0.1mm. This results in an effect known as "heat dissipation," or "reduction of thermal resistance." With excellent thermal conductivity and low thermal resistance, these synergistic effects enable efficient heat dissipation designs without the need for expensive substrates, by closely attaching the substrate with heat-generating components to a metal housing or similar structure to facilitate heat escape.
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Applications/Examples of results
Printed circuit boards equipped with components that generate high heat during operation, such as high-brightness LEDs and power semiconductors.
Line up（3）
| Model number | overview |
|---|---|
| CS-3945 | Thermal conductivity = 1.8W/mK. This is six times that of standard FR-4. The appearance has been designed in white with the consideration of mounting LED components. The whiteness is designed to remain high even when exposed to high temperatures for extended periods. |
| CS-3295 | Thermal conductivity = 3W/mK. This is ten times that of standard FR-4, and it is intended for use around power semiconductors. Even when made thin at 0.06mm to reduce thermal resistance, it has an insulation withstand voltage of 3000 volts. It excels in connection reliability even under harsh temperature conditions. |
| ES-3245 | This is the prepreg for CS-3295. When used as a structural material that also serves as an adhesive when bonding to a heat sink, it increases the design flexibility of heat dissipation. |
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Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
