High-speed eutectic die bonder
The AD211Plus-II is a device capable of high-speed eutectic bonding of diced chips to substrates or lead frames. It has a strong track record of implementation for LEDs, including automotive lighting and outdoor lighting. Product Features: - Alignment accuracy: 7μm - Cycle time: 540ms - Mirage prevention function during heat-up - Distinctive work holder/heat-up stage - Control function with a void rate of 3% or less - Extensive domestic and international implementation track record - Applications: Automotive, photonics, LEDs, LiDAR
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basic information
Alignment accuracy: ± 7 μm @ 3σ Cycle time: 540 ms Die size compatibility: 0.15 x 0.15 – 2 x 2 mm Substrate size compatibility: up to 102 x 127 mm Joining method: Eutectic
Price information
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Delivery Time
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Applications/Examples of results
- Applications: Automotive, Photonics, LED, LiDAR
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Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
![[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly](https://image.mono.ipros.com/public/product/image/5e6/2000270614/IPROS22137770162123637982.png?w=280&h=280)
