Manufacturing of high-precision vacuum devices through hail processing.
【5 Strengths】 ■ Skilled in sizes from palm-sized to 2000 ■ Proficient in aluminum high-speed machining and difficult-to-cut materials ■ Specializes in complex shapes and precision parts ■ Experienced with thin-walled parts that are prone to distortion ■ Capable of consistent support for prototype machining up to 1000 pieces with automated equipment and a 24-hour system *We have processing examples available. For more details, please contact us or visit our website.
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basic information
In the semiconductor field, there are strict requirements where "even a hairline scratch is unacceptable." - Processing of components used for wafer transport in clean rooms - High-precision component processing for robotic arms and similar applications - Flexible response to special processing such as "Hale processing" for chamber components and "electropolishing" for gas supply components ---------------------------------------------- [Manufacturing of high-precision vacuum devices through Hale processing] Customer's Challenge There is variation in product precision, and unstable performance due to air leaks is a concern. Additionally, there are worries about unstable delivery times affecting the production schedule. Our Solution We finish the sealing surfaces of vacuum devices using "Hale processing" with advanced precision machinery. This resolves the variations in precision that could not be avoided with traditional manual finishing, providing stable high quality. As a result, the durability and reliability of our customers' products are improved, achieving consistent quality.
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Applications/Examples of results
We can flexibly respond to everything from prototype development to repeat mass production, regardless of the industry, so please feel free to consult with us.
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Company information
Sixty years since its founding. We have extensive achievements in the aerospace, medical, and semiconductor fields. We have achieved a thickness of 0.1mm in the processing of "thin materials," which are prone to distortion, through our unique jig and cutting tool design. We also handle the processing of "difficult-to-cut materials" such as Inconel and titanium, with experienced craftsmen and certified inspectors ensuring the quality of our products. ● Achievements in "thin material" processing through weight reduction cultivated in the aerospace field - Processing of various parts such as aircraft body components, satellite components, and defense components - Specializing in difficult processing that requires technology through our unique jig and cutting tool design ● In the semiconductor field, there are strict requirements where "even a hairline scratch is unacceptable" - High-precision parts processing such as components for wafer transport - Flexibly responding to special processing such as "Hale processing" and "electrolytic polishing" ● In the medical field, parts that enter the body prioritize "safety and security" - Processing of components for implants and prosthetic limbs - Collaborating with doctors and experts to support technical challenges in the medical field from the prototype development stage ● Prototype development in next-generation fields - Exploring whether the know-how and achievements cultivated in the aerospace field can be applied to new areas. We are actively challenging prototype development for flying cars, hydrogen engines, EVs, and more.
![[Processing Example] Semiconductor Components](https://image.mono.ipros.com/public/product/image/64d/2000587365/IPROS98029830569304624558.png?w=280&h=280)
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
