【Exhibition Participation】Recommended for the semiconductor backend, organic packaging, and assembly industries! Automatically and evenly attaches solder balls.
The "Solder Bouncer Line" is an automatic ball mounting line for flip chip solder bumps, which eliminates the need for a mask during ball mounting thanks to our patented technology that utilizes vibration. Image inspection tailored to the purpose is installed inline. Our unique vibration transfer technology allows for testing with various shapes and sizes. We are currently accepting tests with great enthusiasm. 【Features】 ■ Can evenly attach solder balls to flux ■ Enables maskless solder ball mounting ■ Easy to switch between varieties and user-friendly ■ Contributes to improved yield Additionally, we will be exhibiting at "SEMICON JAPAN 2024" held at Tokyo Big Sight (Hall 2, Booth 2655). We sincerely look forward to your visit. *For more details, please download the PDF or feel free to contact us.
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【Exhibition Participation Information】 <SEMICON JAPAN> Dates: December 11 (Wednesday) - 13 (Friday), 2024 Venue: Tokyo Big Sight Booth Number: East Hall 2, 2655 *For more details, please download the PDF or feel free to contact us.
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【Usage】 ■When using solder balls such as BGA *For more details, please download the PDF or feel free to contact us.
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The scope of printing technology is increasingly expanding into fields such as solar cells, smartphones, and various electronic components, with a growing demand for "high-precision screen printing" technology. Thanks to your support, our company is celebrating its 35th anniversary and has developed into a company that is recognized by global enterprises creating new markets for the next generation. Among the few manufacturers of high-precision printing machines, our technology is trusted and valued by our customers. Today, our products have become indispensable to the advancement of cutting-edge printed electronics, spanning a wide range from electronic components to solar cells, fuel cells, FPCs, and smartphones. Moving forward, we will continue to prioritize customer satisfaction as we have in the past, dedicating ourselves to technology development that anticipates the needs of the times, and striving to deliver even higher precision products and services to meet our customers' expectations, while continuing to take on challenges both domestically and internationally.