[Case Study Presentation] CAM Joining Enabled Dissimilar Material Bonding with Low Thermal Resistance
The bonding strength is secured at over 10 MPa in shear tension! It is possible to join dissimilar materials such as metals, resins, and ceramics, which is essential for improving heat dissipation characteristics.
Our company conducts trial processing, specialized CAM agents, and process development using CAM bonding technology. This bonding technology combines chemical bonding and fusion. It is environmentally friendly, allows for easy construction, and can reduce costs. CAM agents are applied and dried on metal surfaces to form an organic film, which bonds the joined materials through thermal pressing. You can read technical documents that describe detailed features and functions. 【Examples of bondable materials】 ■ Metals: Aluminum, Copper, Steel, Titanium ■ Resins: Nylon, PBT, CFRP ■ Ceramics: Alumina, Glass ■ Zero thermal resistance is also possible.
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【Features of Low Thermal Resistance CAM Agents】 ■M8.xx: Water-soluble, conductive ■G4.xx: Non-water-soluble, insulating, transparent ■Q1.xx: Non-water-soluble, conductive ■Q3.xx: Non-water-soluble, insulating ■Q5.xx: Non-water-soluble, insulating, inexpensive *For more details, please feel free to contact us.
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Our company is engaged in the development of joining technologies. The newly developed CAM joining can handle a range of applications, starting from the joining of dissimilar materials such as metal and resin, to metal-metal joining that includes dissimilar metals. CAM joining can achieve zero thermal resistance and is also applicable to the laminated joining of multilayer thin plates.