Case Study of Automated Visual Inspection: Example of Warpage Inspection of Circuit Boards Using 3D Sensors

A case study of automating visual inspection to check the warping condition of substrates flowing on the conveyance line using a 3D sensor installed on the line!

Regarding the confirmation of the warping condition of the circuit boards being transported on the line, would you consider switching from "individual measurement" to "automated inspection using 3D sensors"? By installing 3D sensors on the existing transport line and conducting measurements, we can create a system that checks the warping condition during transport without having to individually remove and inspect the circuit boards. By using 3D sensors, it becomes possible to measure the warping condition of the circuit boards passing under the sensor without the need to individually measure specific locations using calipers or gap gauges. 【Features of this system】 ■ Inspection can be performed on the transport line without creating a separate inspection system. ■ Since inspections are conducted on the transport line, it is possible to perform inspections without creating additional equipment. ■ By using 3D sensors, it is possible to measure the condition of the circuit boards without individual measurements. ■ The equipment can be modified based on the inspection requirements. *First, we will verify whether the work you wish to inspect is feasible. *Detailed processing information and flow are included in the PDF.

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