Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.
We would like to introduce a case study regarding the solution to the "heat dissipation of metal substrates" that we addressed. The customer company was facing the challenge of efficiently dissipating heat generated from a metal base substrate within the limited height of their module. By placing block-shaped copper terminals around the heat source and transferring the heat to an aluminum plate through thermally conductive silicone, we resolved the issue. 【Case Overview】 ■ Customer's Concern - They wanted to efficiently dissipate heat generated from the metal base substrate within the limited height of the module. ■ Solution - We placed block-shaped copper terminals around the heat source and transferred the heat to an aluminum plate through thermally conductive silicone. *For more details, please download the PDF or feel free to contact us.
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For terminal design, manufacturing, and sales, as well as circuit board connections, turn to Iclex. To provide connection devices that meet customer needs, connection technology, product technology, and manufacturing technology are essential. Iclex is a company that manufactures custom products as standard items using the various know-how it has cultivated over the years.