[Case Study] Heat Dissipation of Metal Substrates

Place block-shaped copper terminals around the heat source! Transfer heat to the aluminum plate through thermally conductive silicone for heat dissipation.

We would like to introduce a case study regarding the solution to the "heat dissipation of metal substrates" that we addressed. The customer company was facing the challenge of efficiently dissipating heat generated from a metal base substrate within the limited height of their module. By placing block-shaped copper terminals around the heat source and transferring the heat to an aluminum plate through thermally conductive silicone, we resolved the issue. 【Case Overview】 ■ Customer's Concern - They wanted to efficiently dissipate heat generated from the metal base substrate within the limited height of the module. ■ Solution - We placed block-shaped copper terminals around the heat source and transferred the heat to an aluminum plate through thermally conductive silicone. *For more details, please download the PDF or feel free to contact us.

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