[Exhibition Report] We exhibited at NEPCON Japan 2025!

Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.

We have newly launched an "Electronics Manufacturing Services (EMS)" that provides a comprehensive response from material procurement, circuit design, manufacturing, and assembly to functional testing and shipping in the traditional FPC (Flexible Printed Circuit Board) manufacturing process. In recent years, the use of FPCs has expanded across various fields such as medical devices and industrial equipment, leading to an increased demand not only for supply but also for a one-stop solution that encompasses circuit design, module manufacturing, and even final product assembly. To meet these market demands, we have strengthened our collaboration with electronics manufacturing companies and established a manufacturing system that covers everything from material procurement to assembly. With this service, customers can reduce interactions with multiple vendors, achieve shorter lead times, and improve manufacturing efficiency. Our stringent quality control system ensures the delivery of highly reliable products. The product areas we can support include automotive devices, medical devices, industrial equipment, robotics, communication devices, lighting equipment, and home appliances, allowing us to meet a wide range of manufacturing needs.

◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots