【TTL_Exhibition Participation Information】JPCAShow2025 'Newly Developed Topics.'

Newly developed material.

◆FPC (Flexible Printed Circuit Board)◆ 　　　~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ 　　　　　FPC manufacturing requires multiple critical processing steps. 　　　　　Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. 　　　　　This time, we will introduce the "strengths" we have cultivated over many years in each process! 　　　　　<Design> Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Treatment> High precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High precision outline processing ±50μm, diverse tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ 　　　Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ 　　　Proposals for utilizing FA and collaborative robots

• Printed Circuit Board

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

• Printed Circuit Board
• Transport and handling robots
• Visual Inspection Equipment

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

• Printed Circuit Board
• Other electronic parts
• Other cable related products

With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.

Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology

• Printed Circuit Board

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.

〇Uses polyimide with excellent heat resistance and flame retardancy. ⇒【Compatible with reflow mounting】 ★ For display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

• Other electronic parts

Attention those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!

This document summarizes the types and applications of high-performance FPCs. High-performance FPCs are capable of solving various challenges such as cost reduction and space-saving. In this document, we introduce the features and application examples of special bumps, long and ultra-thin FPCs, and highly flexible FPCs. More detailed information is also available, so please take a moment to read through it. 【Contents】 ■ Types of high-performance FPCs ■ Features ■ Application examples *For more details, please refer to the PDF document or feel free to contact us. #ShortLeadTime #MassProduction #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #UltraThin #Flexible

• Other electronic parts

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

• Other electronic parts

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (Fluoropolymer Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluoropolymer composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss for stable high-speed, high-capacity communication. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

• Other electronic parts

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

• Other electronic parts

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #Flexible substrate #Flexible printed wiring board #Circuit board #Printed circuit board #High frequency #Impedance #Short delivery time #Mass production

• Other electronic parts

From high-frequency applications to the design, manufacturing, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating the various characteristics of new materials that are being improved daily.

• Printed Circuit Board

We have compiled terms used in meetings related to FPC manufacturing. Please use it as an introductory mini-dictionary and an offline search tool.

Thank you for taking the time to view this. With over 40 years of experience in flexible printed circuit board manufacturing, we offer a one-stop service from prototyping to mass production. There are things that can only be done by TAIYO. *The following content is from the complete version of "Everything You Need to Know About FPC in One Book! *Includes a Glossary." Highly recommended! [Content of the Document] 1. Solve your FPC problems all at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Introduction to various FPCs (ultra-fine wires, multilayer, high frequency, etc.) 7. FPC glossary 8. Greetings and company overview (36 pages in total) We hope this will be helpful in your consideration of flexible printed circuit boards. Taiyo Industry will sincerely respond to your inquiries regarding FPC.

• Printed Circuit Board

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method involves forming wiring on ultra-thin copper foil through plating (semi-additive method). The method we are introducing this time is one of the semi-additive processes called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to form ultra-fine and high-density patterns that are difficult to achieve with the subtractive method. Additionally, by combining it with the "via filling technology" that fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes as well, further increasing wiring density. **Features of the MSAP Method** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-sections contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighPrecisionSubstrate #Flex #FlexiblePrintedCircuitBoard

• Printed Circuit Board
• Circuit board design and manufacturing

Consistent support from development design to parts procurement, manufacturing, implementation, and assembly with short delivery times. Capable of small lot and diverse prototype and mass production.

Our company handles everything from the design to manufacturing and assembly of FPC (Flexible Printed Circuit Boards) in a one-stop service. We can flexibly respond to a wide range of needs, including prototypes and development trials, one-off and irregular orders, and mass production, all with short delivery times. Since we use sheet materials, we can produce small lots without a minimum quantity requirement. The initial lead time for mass production is at least three weeks. We thoroughly manage quality using various inspection equipment, and we have a wealth of experience in fields with particularly high quality demands, such as automotive and medical applications. 【Features】 ■ Shortened lead times for product development and reduced development costs through small-lot prototyping ■ Rapid startup during mass production and flexible responses to production lot variations ■ Comprehensive support from design to board assembly (mounting support and in-house metal mask manufacturing) ■ Support for component procurement for both prototypes and mass production ■ Proposals for appropriate methods and tools (jigs) for FPC manufacturing from production planning ★ Currently, we are offering a glossary of FPC-related terms and materials about our products. Please check it out via "PDF Download." Feel free to contact us with any inquiries.

• Contract manufacturing

We welcome inquiries and consultations regarding flexible procurement challenges! We respond to various requests, including halogen-free types. We cater to everything from digital cameras to the aerospace field!

Please leave it to us for everything from small-scale prototypes (for research and development purposes) to mass production. 'FPC (Flexible Printed Circuit)' is a type of printed circuit board that is based on flexible and thin insulating materials such as polyimide, allowing for flexible bending. Taiyo Kogyo has extensive experience and achievements, enabling us to manufacture FPCs tailored to various needs. They are used in digital cameras, smartphones, laptops, robots, automobiles, car navigation systems, medical devices, aerospace, and more. Additionally, we also offer halogen-free types, and please feel free to consult us regarding combinations of various types and thicknesses. [Features] - A type of printed circuit board - Good flexibility with materials like polyimide - Based on thin insulating materials - Flexibly bendable - Halogen-free types are also available *For more details, please refer to the PDF materials or feel free to contact us.

• Printed Circuit Board
• Other electronic parts
• Circuit board design and manufacturing

Introduction to high-difficulty FPCs, specific issues, and TAIYO's one-stop service, covering the basics of flexible substrates (glossary)!

Thank you for taking a look. With over 40 years of experience in flexible printed circuit board manufacturing, we offer a one-stop service from prototyping to mass production. There are things that can only be done by TAIYO. 【Contents of the document】 1. Solve all your FPC problems at once! 2. What is FPC? 3. One-stop service 4. Achieving short delivery times 5. Support from prototyping to mass production 6. Information on various types of FPC (ultra-fine wires, multilayer, high frequency, and more) 7. FPC glossary 8. Greetings and company overview (Total of 36 pages) We hope this information will be helpful in your consideration of flexible printed circuit boards. Taiyo Industry will sincerely respond to your inquiries regarding FPC.

• Printed Circuit Board
• Other electronic parts
• Other cable related products

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Features: ● Equipped with Intel Core Ultra 7 255H/7 155H/5 225H/5 125H ● LPDDR5x 16GB/32GB/64GB onboard ● M.2 NVMe 256GB onboard ● USB 2.0 x 8, USB 3.2 (10Gbps) x 4 ● PCIe Gen 4 [x8] x 1, PCIe Gen 3 [x1] x 4, PCIe Gen 3 [x4] x 1 (2 lanes co-lay with SATA; BOM option) ● 2.5GbE x 2 ● COM-HPC Mini standard, size 95mm x 70mm ● Optional items ECB-980A: Development carrier board HPC-ARHm-FAN01: CPU fan HPC-ARHm-HSP01: Heat spreader (Note: heat dissipation is required in the enclosure)

Features: ● Equipped with Jetson AGX Orin 32GB/64GB ● Gigabit LAN ×1, 10Gigabit LAN ×1 ● USB 3.2 Gen 2 (Type-A) ×4 ● DB-9 connector ×1 (for DIO 8 channels) ● DB-9 connector ×2 (supports RS-232/422/485: Rx/Tx/RTS/CTS) ● Jetpack 6.0.0 pre-installed