Types and Examples of High-Performance FPC [Special Bumps, Long and Ultra-Fine, High Flexibility]
Attention those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!
This document summarizes the types and applications of high-performance FPCs. High-performance FPCs are capable of solving various challenges such as cost reduction and space-saving. In this document, we introduce the features and application examples of special bumps, long and ultra-thin FPCs, and highly flexible FPCs. More detailed information is also available, so please take a moment to read through it. 【Contents】 ■ Types of high-performance FPCs ■ Features ■ Application examples *For more details, please refer to the PDF document or feel free to contact us. #ShortLeadTime #MassProduction #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #UltraThin #Flexible
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#ShortLeadTime #MassProduction #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #UltraThin #Flexible
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For more details, please refer to the PDF document or feel free to contact us.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*

