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  1. Home
  2. Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社 和歌山
  4. [Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method
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  • Oct 27, 2025
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Oct 27, 2025

[Press Release from Taiyo TechnoRex] Regarding the Improvement of High-Density Wiring Formation Technology Using the Patterned Beer Fill Method

太洋テクノレックス 太洋テクノレックス 本社 和歌山
Our company has further improved the technology for forming high-density wiring in our core business of electronic substrates, specifically in flexible printed circuit boards (FPCs). In recent years, electronic devices such as medical equipment and industrial machinery have been advancing in miniaturization and lightweight design. To incorporate many functions into limited space, there is a demand for increased wiring density on the substrate. Therefore, we have been working on establishing filled via technology and improving the M-SAP method. The filled via structure involves filling vias (holes) made by laser in the insulating layer with copper plating, ensuring electrical connections on both sides of the substrate while reducing the recesses of the vias, which allows for component mounting on the vias and leads to high-density mounting. On the other hand, the M-SAP method significantly improves line width management by laminating copper to form circuits, enabling high-density wiring. This time, based on the pattern via fill method that leverages these characteristics, we successfully formed wiring with a pitch of 30μm on a double-sided substrate with a filled via structure. We will continue to aim for further improvements in high-density wiring formation technology through ongoing development, prototyping, and verification.
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パターンビアフィル工法による高密度配線の形成技術向上について.pdf[397403]

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News 2025 All | Taiyo Technorex Co., Ltd.

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FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

  • Printed Circuit Board

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EMS - Comprehensive Contracting Services

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜  ☆ ~ ☆ ~ Do you have any of the following concerns? ~☆ ~ ☆   • Looking for a reliable manufacturing partner for new product development   • Considering outsourcing as you do not have a manufacturing line   • Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

  • Circuit board design and manufacturing
  • EMS

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Liquid Leak Testing Device - A "new" solution to make liquid leaks visible.

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

  • Sensors
  • Filling and bottling machines
  • Liquid and beverage filling machines

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Taiyo Technorex Co., Ltd. Company Profile

This is the company profile of Taiyo Technorex. (Company name change effective December 21, 2023)

Taiyo Industrial Co., Ltd. (Established December 1960) Taiyo Technolex Co., Ltd. (Name changed December 2023) [Thoughts Behind the New Company Name] The coined term "TECHNOLEX," derived from "Technology" and "Flexible," symbolizes the flexibility of our main product, FPC (Flexible Printed Circuit Board), as well as our commitment to adapt flexibly not only to conventional technologies but also to new technologies and areas such as technology trading. We are evolving beyond the confines of "industry" and looking towards a transition to a more global market.

  • Printed Circuit Board
  • Transport and handling robots
  • Circuit Board Inspection Equipment

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High-frequency compatible flexible substrate (MPI specification)

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (MPI Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has excellent heat resistance and can accommodate solder mounting and bonding. 〇 It allows for high flexibility in processing, similar to standard polyimide. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

  • Other electronic parts

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High-frequency compatible FPC (fluoropolymer composite material specification) flexible printed circuit board

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High-Frequency Compatible FPC (Fluoropolymer Composite Material Specification)" is a product designed to address low transmission loss and impedance matching. 〇 The fluoropolymer composite material has particularly excellent inductive characteristics. 〇 Achieves extremely low transmission loss for stable high-speed, high-capacity communication. ● FPC high-frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedWiringBoard #CircuitBoard #PrintedCircuitBoard #ShortLeadTime #MassProduction

  • Other electronic parts

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High-frequency compatible flexible substrate (LCP specification) high temperature and humidity resistant FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

The "High Frequency Compatible FPC (LCP Specification)" is a product designed to support low transmission loss and impedance matching. 〇 It has moisture absorption characteristics that are less affected by humidity and other factors. ● FPC high frequency analysis service (optional) It can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables #Flex #FPC #Flexible substrate #Flexible printed wiring board #Circuit board #Printed circuit board #High frequency #Impedance #Short delivery time #Mass production

  • Other electronic parts

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[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering   >> There are multiple important processing steps in FPC manufacturing.     Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development.     We have introduced the "strengths" we have cultivated over many years in each process:      <Design>   Circuit design, artwork, S-parameter analysis      <Layer Connection> Build-up FPC, filled vias, small-diameter vias      <Circuit Formation> MSAP method, thin copper, thick copper      <Insulation Processing> High-precision openings ±20μm, LCP coverlay      <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.)      <Post-Processing> High-precision contour processing ±50μm, a variety of tools      <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing   >> Normally, there are no opportunities to see anything other than the finished product,     but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing.      *Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Transport and handling robots
  • Visual Inspection Equipment

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[Presentation of Materials] Until FPC is completed...

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

This document introduces the manufacturing process of FPC (Flexible Printed Circuit) conducted by Taiyo Techno-Rex Co., Ltd. How are flexible printed circuit boards made? This material is intended for those who want to learn about FPC. It explains the manufacturing process after the design of standard specification FPC. [Contents (excerpt)] ■ Exposure ■ Through-hole drilling ■ Copper plating ■ Dry film lamination ■ Exposure * The PDF version is available for download. * A PowerPoint version is also available upon request.

  • Printed Circuit Board
  • Other electronic parts
  • Other cable related products

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Flexible substrate short delivery service (FPC - flexible)

With Taiyo Techno Rex's FPC short delivery service, high quality and smooth transition to mass production can be achieved.

Unified management from prototype to mass production! ■ Reliable track record ■ One-stop service ■ Flexible responsiveness ■ Short delivery times, high quality, latest technology

  • Printed Circuit Board

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Transparent FPC (Transparent Flexible Printed Circuit Board)

Transparent flexible printed circuit boards contribute to improved design with excellent transparency! The fine patterns make the wiring inconspicuous.

〇Uses polyimide with excellent heat resistance and flame retardancy. ⇒【Compatible with reflow mounting】 ★ For display devices such as digital signage, as well as medical devices and transparent film antennas! ★ We also accommodate small quantities and a variety of prototypes. For more detailed information, please contact us. #Transparent #Transparent FPC #Transparent Flex

  • Other electronic parts

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Types and Examples of High-Performance FPC [Special Bumps, Long and Ultra-Fine, High Flexibility]

Attention those struggling with cost reduction and space-saving for flexible printed circuit boards (flexible substrates)! We can provide optimal proposals tailored to your needs!

This document summarizes the types and applications of high-performance FPCs. High-performance FPCs are capable of solving various challenges such as cost reduction and space-saving. In this document, we introduce the features and application examples of special bumps, long and ultra-thin FPCs, and highly flexible FPCs. More detailed information is also available, so please take a moment to read through it. 【Contents】 ■ Types of high-performance FPCs ■ Features ■ Application examples *For more details, please refer to the PDF document or feel free to contact us. #ShortLeadTime #MassProduction #Flex #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #UltraThin #Flexible

  • Other electronic parts

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Bump FPC

A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)

The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. It is optimal for testing fine-pitch insertion terminals and display lighting tests when combined with our contact clips and hand presses. *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction

  • Other electronic parts

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High-frequency compatible FPC

Supports low transmission loss and impedance matching! There are various applications such as mobile electronic devices and IoT devices.

"High-Frequency Compatible FPC" and "High-Frequency Compatible Flexible Printed Circuit Board" are products designed to support low transmission loss and impedance matching. Specifications include coplanar lines, microstrip lines, and strip lines. They can be used for various applications. 【Examples of Applications】 ■ Mobile electronic devices such as smartphones ■ Optical communication modules ■ IoT devices ■ Video equipment (4K/8K) ■ Other alternatives to coaxial cables *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance #ShortLeadTime #MassProduction

  • Other electronic parts

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To thrive in the era of soaring cocoa prices, trust Samak for the development of cluster products!

  • NEW
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To everyone who wants to develop new chocolate products without worrying about the soaring cocoa prices. Cluster products that enhance texture, aroma, and appearance while reducing the amount of chocolate used, adding value to the products. We offer three types of cluster manufacturing equipment that can be selected according to your application and goals. We can propose the most suitable equipment based on your objectives. 1) K&S / GFT | One-bite snack & cereal bar molding machine 2) Trkino / Nuts-i | High-end depositor that can deposit ingredients like nuts together 3) Wolf / PORTIOMAT – CLUSTER FORMING | Cluster former equipped with innovative technology

May 04, 2026

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Pacific Avenue Capital Partners has begun exclusive negotiations to acquire Amcor's European waste container business "ESE World."

  • NEW
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Los Angeles (California, USA) / Paris (France), May 4, 2026 - (JCN Newswire) - Pacific Avenue Capital Partners, a global private equity firm focused on corporate carve-outs and other complex transactions in the mid-market, announced today that its affiliate has entered into exclusive negotiations to acquire ESE World (hereinafter "ESE") from Amcor, one of the world's leading packaging companies. With the support of Pacific Avenue, ESE will focus on responding to customer needs while implementing multiple growth initiatives related to operational improvements, regional expansion, and strategic add-on acquisitions. Pacific Avenue plans to work closely with ESE's existing management team to drive these initiatives and accelerate the company's next phase of growth.

May 04, 2026

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

  • NEW
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Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

May 01, 2026

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Non-contact light beam touch sensor "HA-T Series"

【Catalog now available!】Energy-saving automatic door sensors "HA-T401/HA-T520"

  • NEW
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The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who wish to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. You can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520" depending on the application and installation location. 【Recommended for such places!】 ☑ Entrance facing a busy corridor ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passages ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing, contributing to energy-saving by minimizing wasteful power consumption ● Equipped with a light touch function, allowing the door to open and close just by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.

May 01, 2026

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Micro Mist Spray Dryer MDL-050(C)M

Spray drying contract and testing now accepting applications.

  • NEW
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***Contract Processing Now Accepting Orders*** We can accommodate small lots and a variety of sample tests, including spray drying with organic solvents. Please feel free to contact us. ----Example of a Prototype Schedule---- 9:30 Pre-test Meeting 10:00 Spray Drying Test Starts 12:00 Lunch Break 13:00 Spray Drying Test Resumes 16:00 Post-test Meeting

May 01, 2026

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