High-frequency compatible flexible substrate (MPI specification)

◆FPC (Flexible Printed Circuit Board)◆ ~Tayo Technorex's Strengths in the FPC Manufacturing Process~ The manufacturing of FPC requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High-precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High-precision outline processing ±50μm, diverse tools <Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots

Our company is working on the development of build-up substrates using polyimide for the insulation layer, aimed at miniaturization, thinness, and lightweighting of multilayer substrates in our core electronic substrate business. We are pleased to announce that we have established the core filled via technology. In electronic devices, which are becoming lighter, more compact, and more functional, substrates (build-up substrates) capable of high-density wiring and high-density mounting are in demand. However, typically, the core layer of build-up substrates uses rigid boards, which increases the thickness of the substrate and hinders the lightweight and compact design of electronic devices. The filled via technology we have established involves filling holes (vias) made by laser in flexible printed circuit boards (FPC) with polyimide insulation, and flattening the surface of the filled areas. By using this FPC as the core layer or outer layer of build-up substrates, it becomes possible to achieve both high-density wiring and high-density mounting while maintaining thinness. We plan to start providing build-up substrates using this technology within the fiscal year 2022, and furthermore, by applying this technology to our strength in high-frequency compatible FPCs, we will respond to the demand for miniaturization of communication devices.

Our company is working on the development of build-up substrates using polyimide for the insulating layer, aimed at miniaturizing, thinning, and lightening multilayer substrates in our core electronic substrate business. We are pleased to announce that we have established the core filled via technology. In electronic devices that are becoming lighter, more compact, and high-functioning, substrates (build-up substrates) capable of high-density wiring and high-density mounting are in demand. However, typically, the core layer of build-up substrates uses rigid boards, which increases the thickness of the substrate and hinders the lightweight and compact design of electronic devices. The filled via technology we have established involves filling holes (vias) made by laser in flexible printed circuit boards (FPC) with an insulating layer of polyimide with copper, and flattening the surface of the filled areas. By using this FPC as the core layer or outer layer of build-up substrates, it becomes possible to achieve both high-density wiring and high-density mounting along with thinning. We plan to start providing build-up substrates using this technology within the fiscal year 2022, and furthermore, by applying this technology to our strength in high-frequency compatible FPCs, we will respond to the demand for miniaturization of communication devices.