Newly developed material.
◆FPC (Flexible Printed Circuit Board)◆ ~Taiyo Techno-Rex's Strengths in FPC Manufacturing Processes~ FPC manufacturing requires multiple critical processing steps. Improving the "strengths" of each process directly leads to advancements in technology and quality, as well as new product development. This time, we will introduce the "strengths" we have cultivated over many years in each process! <Design> Circuit design, artwork, S-parameter analysis <Layer Connection> Build-up FPC, filled vias, small-diameter vias <Circuit Formation> MSAP method, thin copper, thick copper <Insulation Treatment> High precision openings ±20μm, LCP coverlay <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) <Post-Processing> High precision outline processing ±50μm, diverse tools <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◆Various Substrates and Ceramic Materials◆ Introduction of AI technology, final appearance inspection equipment, and electrical testing equipment ◆Efficiency and Automation◆ Proposals for utilizing FA and collaborative robots
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* Flexible printed circuit board * FA (Factory Automation) * Final appearance inspection system
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Please leave the FPC design, prototyping, small to medium lot production, and assembly to us. We propose systems suitable for final appearance inspection of high-precision substrates, ceramics, and automation using material handling and collaborative robots.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*