Press Release from Taiyo Techno Rex: Announcement of Participation in the 40th Internepcon Japan

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

• Printed Circuit Board

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

• Printed Circuit Board
• Transport and handling robots
• Visual Inspection Equipment

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

• Printed Circuit Board
• Transport and handling robots
• Visual Inspection Equipment

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

• Sensors
• Filling and bottling machines
• Liquid and beverage filling machines

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ 　☆ ～ ☆ ～ Do you have any of the following concerns? ～☆ ～ ☆ 　　• Looking for a reliable manufacturing partner for new product development 　　• Considering outsourcing as you do not have a manufacturing line 　　• Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

• Circuit board design and manufacturing
• EMS

● The production time for casting prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly creating sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or variations in dimensions, can be created in a single molding process. This allows for the verification of multiple types in a short period.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without affecting the base material with heat. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

This time, the ACS-5000 is available as a facial recognition terminal compatible with FaceMe Security's add-on feature "Face Terminal," enabling access control management that combines "advanced anti-spoofing features" with high-speed facial recognition powered by edge AI. ■ Main Features 1. Accelerated Authentication Processing FaceMe Security is optimized for the MediaTek Genio 700's NPU, achieving faster facial recognition processing and reduced CPU load compared to processing solely on the CPU. It ensures stable authentication without delays even during peak times such as clocking in and out, contributing to alleviating congestion. 2. Advanced "Anti-Spoofing" Optimized for the IR + RGB camera mounted on the ACS-5000, it can quickly detect fraudulent authentication using photos, videos, or 3D masks within 0.6 seconds, ensuring reliable identity verification. 3. Door Control Without Additional Equipment FaceMe Security can directly control the digital I/O of the ACS-5000, allowing for the construction of an access control management system without the need for additional equipment. This simplifies system configuration and reduces implementation costs.

This is an air leak tester for battery cases of electric vehicles (EVs). The battery case has the characteristic of being "large with a significant internal volume, and its structure may deform due to internal pressure." As a result, air leak testing generates "noise caused by its large size and capacity" and "noise caused by expansion or deformation due to internal pressurization." To mitigate this noise, this device features a newly developed smoothing function and a linear fitting correction function used in combination during measurement. Additionally, to achieve low-pressure control that is difficult to manage and to expand flow for large volumes, we provide a bypass box (CBU-600) equipped with an electro-pneumatic regulator for precise pressure control and a pressurization valve with a large effective diameter to supply high flow rates. Measurement methods: Work-Work comparison, Work-Master comparison, Fixed Master comparison Measurement pressure range: 10 kPa, 20 kPa, 50 kPa (depending on specifications) Gauge pressure sensor accuracy: ±2% F.S. Differential pressure sensor accuracy: ±0.5% F.S. Group settings: 0 to 31 groups Power supply voltage / Power consumption: AC100 to 240 V / 100 VA

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!