Press Release from Taiyo Techno Rex: Announcement of Participation in the 40th Internepcon Japan

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

• Printed Circuit Board

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering 　　>> There are multiple important processing steps in FPC manufacturing. 　　　　Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development. 　　　　We have introduced the "strengths" we have cultivated over many years in each process: 　　　　　<Design>　　 Circuit design, artwork, S-parameter analysis 　　　　　<Layer Connection> Build-up FPC, filled vias, small-diameter vias 　　　　　<Circuit Formation> MSAP method, thin copper, thick copper 　　　　　<Insulation Processing> High-precision openings ±20μm, LCP coverlay 　　　　　<Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.) 　　　　　<Post-Processing> High-precision contour processing ±50μm, a variety of tools 　　　　　<Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing 　　>> Normally, there are no opportunities to see anything other than the finished product, 　　　　but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing. 　　　　　*Through-hole drilling, exposure/development, etching, contour processing, etc.

• Printed Circuit Board
• Transport and handling robots
• Visual Inspection Equipment

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆ 　　~ Touch, Compare, Experience FPC! ~ 　　　● Comparison of weight between rigid boards and FPC 　　　● Reduction of board area through high-density wiring 　　　● Difference in heat generation temperature due to copper thickness 　　　● Improved work efficiency with transparent FPC, etc. 　　~ Technology Topics ~ 　　　● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results 　　　● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring 　　　● Pattern via fill FPC... Achieving high-density wiring and pad-on-via 　　　● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆ 　　　By achieving teaching-less implementation through visual feedback control, 　　　eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆ 　　　TY-VISION XAIS AI-based defect detection and false report reduction 　　　　・M111SC (manual machine) high-definition (package) board × high-resolution inspection 　　　　・M109SC (manual machine) diverse workpieces × large format

• Printed Circuit Board
• Transport and handling robots
• Visual Inspection Equipment

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

• Sensors
• Filling and bottling machines
• Liquid and beverage filling machines

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ 　☆ ～ ☆ ～ Do you have any of the following concerns? ～☆ ～ ☆ 　　• Looking for a reliable manufacturing partner for new product development 　　• Considering outsourcing as you do not have a manufacturing line 　　• Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

• Circuit board design and manufacturing
• EMS

Features: ●Core 3 N355/N150 ●DDR5 SODIMM x 1 (up to 16GB) ●HDMI 1.4, VGA, LVDS ●2.5GbE x 3, SATA 6Gb/s, GPIO 8-bit ●USB 3.2 Gen 2 x 2, RS-232/422/485 x 2, RS-232 x 2 ●Mini PCIe x 1, M.2 2230 E-Key x 1, M.2 3052 B-Key x 1 ●DC input 9V～36V

Features: ● Equipped with Intel Core Ultra 5 125H/Ultra 7 155H・155U ● DDR5 5600MHz SO-DIMM x2 slots (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, DP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-Key x 1 (PCIe 4.0 [x4]/SATA), M.2 3052 B-Key x 1, M.2 2230 E-Key x 1 ● DC 9~36V input * Heat spreader and fan-equipped heat sink sold separately GENE-MTH6-FAN: Fan-equipped heat sink GENE-MTH6-HSP: Heat spreader * Memory, storage, and OS are sold separately.

Our company will be exhibiting at the "28th IoT & Edge Computing Expo [Spring]" within Japan IT Week, which will be held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday), 2026! We will showcase an AI compact edge PC equipped with NVIDIA's Jetson Thor, boards and PCs featuring Intel's Panther Lake and Bartlett Lake, a vending machine-type demo using ARM boards, as well as touch panel PCs, tablet PCs, and other peripheral devices. ■ Dates: April 8 (Wednesday) - April 10 (Friday), 2026 ■ Hours: 10:00 AM - 6:00 PM (until 5:00 PM on the final day) ■ Venue: Tokyo Big Sight, West Hall 3 ■ Booth Location: W22-22 You can register for your visit at the URL below. We sincerely look forward to your attendance. https://www.japan-it.jp/spring/ja-jp/register.html?code=1606569853287533-WSW

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If you require a detailed technical explanation, please contact us.

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)