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  1. Home
  2. Electronic Components and Semiconductors
  3. 太洋テクノレックス 本社 和歌山
  4. Press Release from Taiyo Techno Rex: Announcement of Participation in the 40th Internepcon Japan
COMPANY NEW
  • Dec 18, 2025
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Dec 18, 2025

Press Release from Taiyo Techno Rex: Announcement of Participation in the 40th Internepcon Japan

太洋テクノレックス 太洋テクノレックス 本社 和歌山
Our company will exhibit at the "40th InterNepcon Japan" held at Tokyo Big Sight from January 21 (Wednesday) to January 23 (Friday), 2026, with the themes of "Experience," "High Density," and "Space." Here, you will not only be able to see a variety of FPCs (Flexible Printed Circuits) on display but also experience their features by directly touching them. Additionally, we will showcase high-density wiring FPCs with filled via structures, as announced in our October 27, 2025 publication on "Improving High-Density Wiring Formation Technology Using Pattern Via Fill Methods," and introduce the technical advantages and development status of FPCs for the space industry that are currently under development. In particular, for FPCs used in the space industry, which require extremely high reliability, we are advancing development with an eye on the standards set by organizations like JAXA, as they are expected to be used under the most severe environmental conditions, including extreme temperature changes, intense vibrations, gas release (outgassing) in a vacuum, and radiation. We will display prototypes that have undergone special material selection and structural design to achieve heat resistance and vibration resistance under harsh conditions. Please come to our booth to confirm the evolution of FPC technology and its potential that our company is pursuing.
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第40回インターネプコンジャパンへの出展のおしらせ.pdf[129217]

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News 2025 All|Taiyo Technorex Co., Ltd.

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スクエア ■表紙.png

FPC - "Technical Information" - Updated September 2025

I would like to introduce the "Technical Information" related to FPC.

● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.

  • Printed Circuit Board

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[Exhibition Report] We exhibited at JPCAshow 2025!

I would like to briefly introduce the successful exhibition content of FPC.

◎Introducing Our Company's "Strengths" in the Processing Engineering   >> There are multiple important processing steps in FPC manufacturing.     Improving the "strengths" of each step directly leads to advancements in technology and quality, as well as new product development.     We have introduced the "strengths" we have cultivated over many years in each process:      <Design>   Circuit design, artwork, S-parameter analysis      <Layer Connection> Build-up FPC, filled vias, small-diameter vias      <Circuit Formation> MSAP method, thin copper, thick copper      <Insulation Processing> High-precision openings ±20μm, LCP coverlay      <Surface Treatment> Standard NiAu to special plating options (Ni-Pd-Au, direct Au, etc.)      <Post-Processing> High-precision contour processing ±50μm, a variety of tools      <Mounting Assembly> Solder mounting, ACF bonding, wire bonding, ultrasonic joining, EMS support ◎Introducing Samples of Each Processing Step During Manufacturing   >> Normally, there are no opportunities to see anything other than the finished product,     but we have provided a chance to view the actual samples of the processes involved in FPC manufacturing.      *Through-hole drilling, exposure/development, etching, contour processing, etc.

  • Printed Circuit Board
  • Transport and handling robots
  • Visual Inspection Equipment

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表紙_出展報告.jpg

[Exhibition Report] We exhibited at NEPCON Japan 2025!

Here is a brief introduction to the successful exhibition content.

<Main Exhibition Content> ◆ FPC (Flexible Printed Circuit) ◆   ~ Touch, Compare, Experience FPC! ~    ● Comparison of weight between rigid boards and FPC    ● Reduction of board area through high-density wiring    ● Difference in heat generation temperature due to copper thickness    ● Improved work efficiency with transparent FPC, etc.   ~ Technology Topics ~    ● High-frequency compatible FPC... Proposing optimal designs and materials based on analysis results    ● Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring    ● Pattern via fill FPC... Achieving high-density wiring and pad-on-via    ● 6-layer stack via FPC... High-density wiring with a stack via structure that forms vias on top of vias ◆ FA Automation ◆    By achieving teaching-less implementation through visual feedback control,    eliminating calibration burdens and realizing high-precision, high-speed automation. ◆ Board Inspection Equipment ◆    TY-VISION XAIS AI-based defect detection and false report reduction     ・M111SC (manual machine) high-definition (package) board × high-resolution inspection     ・M109SC (manual machine) diverse workpieces × large format

  • Printed Circuit Board
  • Transport and handling robots
  • Visual Inspection Equipment

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Liquid Leak Testing Device - A "new" solution to make liquid leaks visible.

Are you aiming for "zero missed leaks" in liquid filling processes? A new liquid leak inspection device utilizing flexible printed circuit boards (FPC)!

An FPC is installed at the mouth of "liquid-filled containers" flowing on production lines such as conveyor belts, enabling instant detection of minute liquid leaks. This contributes to the automation of line stoppages and the elimination of defective products. It is a new inspection solution that realizes "visualization" for quality improvement, cost reduction, and standardization of inspection processes. 【Features】 - High-precision surface detection that surpasses visual inspection capabilities - Inline installation on existing lines is possible (retrofit compatible) - Compatible with various shapes such as bottles, pouches, and nozzles - Eliminates reliance on specific personnel, enabling unmanned operation without the need for training - Automation and standardization of inspection processes through the supplementation of visual inspections - Addresses labor shortages with 24-hour unmanned inspections 【Benefits of Implementation】 - Increased efficiency and improved yield in pre-shipment inspections - Reduced risk of returns and recalls - Lower labor and training costs - Standardization of quality across overseas locations The FPC can be customized according to container shapes through in-house design and manufacturing.

  • Sensors
  • Filling and bottling machines
  • Liquid and beverage filling machines

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EMS.png

EMS - Comprehensive Contracting Services

One-stop service for FPC design, manufacturing, implementation, and finished product assembly all provided by Taiyo Technorex!

We will support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜  ☆ ~ ☆ ~ Do you have any of the following concerns? ~☆ ~ ☆   • Looking for a reliable manufacturing partner for new product development   • Considering outsourcing as you do not have a manufacturing line   • Wanting to request complex board assembly and enclosure assembly, including FPC ★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜★.。.:*+゜ Our company has established a system that can consistently handle everything from design to implementation, assembly, inspection, and shipping, and we support the resolution of challenges in your product development and manufacturing in a broader and more flexible manner. You will be able to focus on development while efficiently bringing high-quality products to market. If you would like detailed materials or case studies about our EMS business, please feel free to contact us. We also welcome those who just want to take a look at the materials!

  • Circuit board design and manufacturing
  • EMS

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Liquid Leak Testing Device - A "new" solution that makes liquid leaks visible.

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Electronic Components and Semiconductors
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KTM Series EB1A Floating Ball Valve

**New Product**【 KTM EB1A】 Floating Ball Valve ***Now On Sale***

  • NEW
  • PRODUCT

This valve is designed in accordance with Japanese standards for applications in chemicals, petrochemicals, reactive monomers, fire-resistant and flammable substances, paper pulp, and more. Main Features Adopts a stem protrusion prevention structure. The seat features a lip structure that enhances the durability of the seat. Additionally, even in the event of seat burn-through, it quickly prevents seat leakage through metal touch. The E seat is excellent in pressure resistance and heat resistance, and its white color eliminates concerns about color contamination. To prevent gland leakage, a re-tightenable gland flange type is adopted. Complies with JIS flange specifications. Electrostatic discharge prevention design according to ISO 17292. Achieves reliable airtightness with a bidirectional flow valve design according to API 598. Fire-safe structure based on ISO 10497:2022 / API 607 8th edition (certified). Atmospheric pollution prevention structure certified to ISO 15848-1 Class BH C03 (certified). Body materials of SCS13A and SCS14A are available. Precision casting. Adopts ISO 5211 top mount, allowing actuator installation without touching the pressure-resistant component, the gland bolt.

Dec 19, 2025

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Release of IsoLite Industrial's 3mm 1600SF Blanket.

  • NEW
  • PRODUCT

IsoLite Industrial 1600SF Blanket with 3mm thickness has arrived. ■ This product is not subject to the Specific Chemical Substances Hazard Prevention Regulations (Tokka Regulations) by the Ministry of Health, Labour and Welfare. For more details, please contact us.

Dec 19, 2025

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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

  • NEW
  • PRODUCT

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Dec 19, 2025

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[Important] Notice of Year-End and New Year Holiday Period

  • NEW
  • COMPANY

Thank you for always using Paper Logic. We would like to inform you about our support system during the year-end and New Year holidays. ■ Holiday Period: December 27, 2025 (Saturday) to January 4, 2026 (Sunday) During the above period, customer support via inquiry forms and emails will be suspended. Inquiries will be accepted, but responses will be provided sequentially starting from January 5, 2026 (Monday). Please note that various functions, including electronic contracts, can still be used as usual during the holiday period. ■ Contact Information for This Matter Please contact us via the [Inquiry Form]. https://paperlogic.co.jp/contact/ We sincerely apologize for any inconvenience this may cause and appreciate your understanding. We look forward to your continued use of Paper Logic.

Dec 19, 2025

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Notice of Year-End and New Year Holidays

  • NEW
  • COMPANY

We would like to express our sincere gratitude for your continued support. We regret to inform you that our company will be closed for the year-end and New Year holidays during the period mentioned below. We kindly ask for your understanding. Please note that during the year-end and New Year period, we expect congestion in shipping services, and depending on the product, it may take longer than usual for delivery. We apologize for the inconvenience and ask that you place your orders with ample lead time. ■ Year-end and New Year Holiday Period From Saturday, December 27, 2025, afternoon to Sunday, January 4, 2026. *Normal operations will resume on Monday, January 5, 2026. ■ Regarding Year-end Shipments - For in-stock items, orders placed by the morning of Thursday, December 25, will be shipped on Friday, December 26. - For made-to-order items, we will handle them after the New Year. - Please note that there will be no shipping operations on Saturday, December 27. We apologize for any inconvenience this may cause our customers and appreciate your understanding and cooperation.

Dec 19, 2025

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