Defect inspection imaging device that visualizes defects in substrates such as glass substrates, semiconductor substrates, and display substrates.
High-speed laser defect scanner for substrates, PrimaScan series. It is a defect inspection imaging device that visualizes defects on substrates such as glass substrates, semiconductor substrates, and display substrates. It achieves high-speed measurements and high PSL particle sensitivity in the nanometer range. Compatible with transparent, translucent, and opaque substrates. The lineup includes PrimaScan, PrimaScan R&D, and PrimaScan P, catering to sample sizes up to 600mm x 600mm. It can be used for wafer incoming inspection, wafer chuck inspection, inspection of blanket films (wafer with film), inspection of internal stress and gaps in micro-lens arrays for AR/VR/MR applications, and inspection of coating defects in photoresists.
Inquire About This Product
basic information
Please contact us.
Price range
Delivery Time
Applications/Examples of results
- Blanket dielectric or metal defect inspection - Variation in coating thickness of glass in microfluidics - Monolayer organic residue - Wafer chuck contamination - Internal stress, air gap, and adhesive overflow in micro-lens arrays for AR/VR/MR - Transparent voids (films, wafers, bonded wafers) - Foreign matter contamination in flat optical components - Haze detection and measurement - Incoming quality inspection of wafers - Defects in photoresist coatings - Defects and surface contamination of photomask blanks - Defects in post-grind/TAIKO wafers (or film frames) - Sample inspection of gel packs, waffle packs, and JDEC sample trays - Incoming quality inspection of unpatterned glass panels - Blanket dielectric or metallic coated panels - Variation in glass film thickness - Monolayer organic residue - Defects in photoresist coatings - Stress across the entire panel and induced point stress - TGV formation inspection - Glass panel wafer edge chips - Haze detection and measurement - Handling and measurement of highly warped/bent wafers
Company information
Nihon Laser, founded in 1968, is the oldest and largest specialized company in Japan for lasers and optical-related products, having grown alongside advancements in laser technology with the support of our customers as a pioneer in the laser trading industry. We allocate just over 10% of our workforce to engineers, making us a trading company with strong technical expertise. We provide excellent laser products and optical-related products from around the world, including the USA, UK, Germany, France, Switzerland, Denmark, and Lithuania. We have established agency agreements with top-class manufacturers in each country, and currently, we have about 50 overseas trading partners. Additionally, we can independently assemble laser-related equipment sourced from around the world and offer it as application systems. While we are a trading company, we also provide services akin to a fabless manufacturer. With gratitude for our customers' demands, we will continue to offer flexible and aggressive solutions.
![Meiling Technica Co., Ltd. [Inline Compatible] Router-Type Circuit Board Divider](https://image.mono.ipros.com/public/product/image/b32/2000674741/IPROS01455756567556534763.jpeg?w=280&h=280)
![[Semiconductor/Wafer Inspection] AI × Full-Color Image Inspection Device AURCA](https://image.mono.ipros.com/public/product/image/2009087/IPROS10607066819809733241.jpg?w=280&h=280)