High dielectric constant & low dielectric loss tangent printed circuit board materials
Rishoraito
Proposal for the miniaturization of millimeter-wave antennas.
This is a printed circuit board material with high dielectric constant (Dk=11.3) and low dielectric loss tangent (Df=0.003). It is a type reinforced with glass cloth using PPE resin (polyphenylene ether), allowing the use of existing machinery and know-how for processing glass epoxy type printed circuit boards (FR-4). We also have prepreg for multilayering (ES-3346) and interlayer adhesive sheets (AD-3396).
Inquire About This Product
basic information
1. High dielectric constant / Dk=11.3 (@1GHz) 2. Low dielectric loss tangent / Df=0.0030 (@1GHz) 3. Good handling with a bending modulus of 14 GPa 4. Low water absorption (0.02%, thickness 1.6mm) 5. Thermal conductivity = 1 W/mK (more than three times that of standard FR-4) 6. Excellent for drilling processing (equivalent to standard FR-4) 7. Existing processing machines and know-how can be utilized 8. Items prepared for multilayer or lamination use
Price range
Delivery Time
Applications/Examples of results
- Miniaturization of high-frequency components such as antennas and sensors - Component-integrated substrates
Line up（3）
| Model number | overview |
|---|---|
| CS-3396 | Copper-clad laminate (CCL). Dk=11.3 / Df=0.003. While ceramic substrates are mainstream for millimeter-wave antennas, they are hard and brittle, requiring advanced technology to cut them into sizes and shapes that fit smartphone housings. On the other hand, CS-3396 can be cut using standard printed circuit board material processing machines. |
| ES-3346 | Prepreg for multilayering. When multilayering high-frequency substrates, this single sheet allows for simultaneous insulation between layers and adhesion between layers without spoiling dielectric properties. |
| AD-3396 | Interlayer adhesive sheet. When embedding components within printed circuit boards, it serves the role of both insulation layer and adhesive. It is provided in a semi-cured state, thinly stretched to about 0.1mm using only high-dielectric resin, sandwiched between release films. Since it does not contain glass cloth, its characteristics are further enhanced with Df=16.5 (1GHz). |
catalog（1）
Download All Catalogs
Company information
The fundamental technologies of our company are Laminating Technology and Casting Technology. We are deeply exploring these two technologies and advancing diversification. In the case of general-purpose products, we continue our self-help efforts, such as pursuing thorough rationalization to become a last-one company.
