Cutting semiconductor materials thinly - Laser Slicing -
Monozukuri (Saitama University Research Seed Collection 2025-27 p.60)
Keywords: Precision microfabrication, abrasive processing, laser processing, semiconductor crystal materials, glass.
Semiconductors are incorporated into everything from smartphones to electric vehicles and AI, but as our lives become richer, global warming continues to progress. This is where next-generation power semiconductor materials are gaining attention. Compared to conventional materials, they are ideal materials with high efficiency and durability, but they are extremely difficult to process, with processing costs being tens to thousands of times higher. In response, our research laboratory has developed laser slicing technology. By transmitting laser light through the material, we utilize the heat generated to form countless microscopic cracks. By creating a fine chain of these cracks, we have developed a technique to slice the material thinly. In our previous research, we have successfully sliced various materials, achieving reductions in processing time and material loss that surpass conventional technologies. Once the material is set, it can be cut instantly without sound or vibration. We aim to achieve a processing technology that is truly like magic.
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Yohei Yamada, Associate Professor Graduate School of Science and Technology, Department of Mechanical Science, Field of Production Science 【Recent Research Themes】 ● Optical lens molding using laser slicing ● Abrasive-free polishing of next-generation power semiconductors ● Free cutting of single crystal diamonds ● High-speed mirror finishing through molten alkali etching ● Formation of mirror-finished microchannels within acrylic resin
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【Appeal Points to the Industry】 ● Compared to conventional methods, material loss is less than 1/3 and processing time is less than 1/2. ● No tool wear, no processing waste liquid, environmentally friendly. ● Capable of processing single crystal materials such as Si, SiC, GaN, and diamond. ● Exploring the expansion of application range to materials like glass and plastic. 【Examples of Practical Applications, Use Cases, and Utilization】 ● Design and prototype development of laser slicing processing machines. ● Lift-off of CVD thin films and epitaxial thin films. ● Alternative to back grinding. ● One-shot molding of optical glass lenses.
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SiC peeling surface
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The Saitama University Open Innovation Center is a center that functions as a liaison office for industry-academia-government collaboration. It consists of three departments: the Industry-Academia-Government Collaboration Department, the Intellectual Property Department, and the Startup Support Department, each staffed with coordinators well-versed in various fields. The center's activities include solving technical challenges in companies, supporting the implementation of joint research, and conducting technology transfer aimed at introducing and utilizing Saitama University's intellectual property.
