Countermeasures for solder wetting during connector substrate mounting! Review of spot Au plating fixtures.

We will introduce a case where a review of the spot Au plating jig successfully reduced the amount of Au plating deposition by 30%. This also contributed to reducing variation in plating between terminals.

We are introducing a case where we addressed the issues faced by our client company by reviewing the spot Au plating fixtures, which led to a reduction in Au usage for Au plated components and an improvement in the Ni barrier function. 【Challenges Faced by the Client】 The existing client was troubled by the rising procurement costs of Au plated components for connectors due to the recent surge in Au market prices. Additionally, they were also struggling with solder wetting on unnecessary areas during the board assembly of the connectors, which prompted them to consult with us. For details on the solution, its effects, and results, please download the case study from the catalog below or feel free to contact us.

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