Plastic surface modification technology that changes the properties of the joint surface itself for bonding.

Hot melt adhesion and adhesives are completely different! There is no worry about shape distortion or the leaching of substances contained in adhesives. Applications in microfluidic devices and organ chips are also possible!

★【Download the Catalog】Those who download will be entered into a lottery to win a novelty item (see image for reference)★ We would like to introduce our "Plastic Surface Modification Technology." Unlike thermal welding or adhesives, this technology changes the properties of the bonding surface itself at the molecular level, allowing for bonding without the risk of shape distortion or leaching of substances contained in adhesives. Therefore, it is suitable for applications such as microfluidic devices and organ chips that require bonding of parts with fine grooves or hole processing. 【For these kinds of challenges】 ■ In microfluidic devices and organ chips that verify cell reactions or drug effects, the leaching of adhesives can potentially affect experimental results. ■ The plastic you want to use has properties that cannot be bonded with adhesives. *For more details, please refer to the related links or feel free to contact us.

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