The required characteristics and various measures are the most important! We also keep in mind the condition of the finished product and how it will be used.
We would like to introduce our "Artwork Design and Circuit Development" services. We expand on the image and consult with the factory in a timely manner about optimal component placement (pitch, TOP/BTM, etc.), re-selecting chip sizes, and how to implement GND, making necessary adjustments. Additionally, our company also handles printed circuit board manufacturing and component assembly. Please feel free to contact us when you need our services. 【Specification Achievements (Example)】 ■ High Frequency/Communication, Radar Related/High-Speed Digital - Kintex UltraScale + GTX/GTH High-Speed Serial I/O - 28GHz Millimeter Wave and Microwave Transmission ■ Various Interfaces/Power Circuits - DDR4 SDRAM (2.4Gbps) - SAMTEC FireFly 28Gbps *For more details, please download the PDF or feel free to contact us.
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Our company specializes in the design, manufacturing, assembly, and component procurement of printed circuit boards, as well as circuit development support, board modifications, and BGA rework/reballing. PCB Design: We have experience designing 400Gbps optical components such as QSFP28 and CFP2, as well as analog high-frequency designs ranging from 60-100GHz. We focus on optimal materials, complex layer structures, and via configurations tailored to the chips used, ensuring the best layout. We excel in designs that consider interference in power, ground, and control signals through DDR4Sim layout and FPGA assignment optimization. Component Assembly: With a compact factory design, our skilled artisans perform assembly work, providing high-quality services from prototypes to medium-lot production. We support high-layer count boards for large-scale FPGAs down to 0402 size C and R chips. Our craftsmen are capable of hand-assembling industrial equipment enclosures, as well as handling various IC replacements and jumper configurations. We also have extensive experience in mixed assembly of wire bond and flip chip. Utilizing skilled, delicate work capabilities along with efficient movements, management methods, and know-how, we handle mass production while delivering various prototypes to our customers on their desired dates.
![[Case Study] Reduction of solderless assembly man-hours / Stabilization of quality](https://image.mono.ipros.com/public/product/image/484/2000567262/IPROS43007692155734724269.png?w=280&h=280)
