Consistent production from circuit board design to bare chip mounting! Abundant experience with high-difficulty projects.
We provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.
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basic information
【Work Contents (Example)】 ■ Wire Bonding ■ Flip Chip ■ Bump Formation ■ ACF Connection ■ Die Bonding ■ Resin Sealing *For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
【Examples of Achievements】 ■ Light element die mount with aligned optical axis ■ Multi-chip package ■ Wire bonding of multiple chips ■ ACF connection (glass substrate - flexible substrate) *For more details, please refer to the related links or feel free to contact us.
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Company information
Our company specializes in circuit board design. With skilled circuit designers handling the design, we believe you will experience a high level of satisfaction in terms of performance and quality. Unlike typical circuit board design companies, we: 1. Have a deep understanding of circuits and digital circuits 2. Can visualize current flow 3. Thoroughly scrutinize device datasheets during the design process Our motto is to conduct designs without rework, contributing to our customers in terms of performance, quality, and delivery time! Additionally, as a fabless manufacturer, we propose the most suitable manufacturing methods tailored to our customers' specifications, costs, and deadlines. We handle FPGA development, power systems, motors, wireless, firmware, and software, allowing us to undertake comprehensive system development projects. We are also happy to accommodate small quantities, such as prototypes and component development products.
