"Hot melt dot coating" can eliminate the hassle of arranging and setting adhesives, thereby reducing bonding time.
Please feel free to contact us at i-kaihatsu@nittobogrp.com. "Hot Melt Dot Coating" We will pre-coat one side of the materials you wish to laminate with hot melt adhesive in a dot pattern. By processing the hot melt in advance, you can eliminate the hassle of arranging and setting up the adhesive at your company, which is expected to shorten the work time. Additionally, dot coating allows for effective adhesion with a minimal amount of adhesive, contributing to a reduction in adhesive usage (and thus a reduction in product weight).
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basic information
First, I would like to exchange information and discuss the feasibility while conducting simple prototypes. Even at the idea stage, please feel free to contact us. Processing Achievements: Base materials: Woven fabrics, knitted fabrics, non-woven fabrics, films Particles, powders: Hot melt adhesives, pigments, inorganic deodorants Binders: General water-based types
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Applications/Examples of results
It is ideal for manufacturers with lamination and bonding processes for various composite materials such as core materials, interiors, and building materials.
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Company information
Nittobo Advantex manufactures and develops products utilizing dot technology. In the field of adhesive interlinings, we develop and manufacture high-quality, high-performance products, and in recent years, we have been actively engaged in the development of sustainability products. The newly launched "D-ALIGN Dot Coating" as a functional processing technique is a unique processing technology cultivated through adhesive interlinings, capable of unlocking various possibilities such as enhancing material performance, quality, and even process improvements. Main features: - Ability to fix functional material powders exposed on the surface - Retention of substrate functionality (flexibility, breathability, sound insulation, stretchability, etc.) - Improved productivity in processes requiring adhesion and lamination.
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![[Example] Preventing metal migration due to moisture in multilayer printed circuit boards.](https://image.mono.ipros.com/public/product/image/984/2000640006/IPROS21370121225881087240.jpeg?w=280&h=280)
