Can be bonded and laminated without compromising the stretchability and flexibility of the materials.
Ideal for layering with stretchable materials.
Please feel free to contact us at i-kaihatsu@nittobogrp.com. We will coat your materials with hot melt adhesive in dot form using "hot melt dot coating" processing. Since it is in dot form, it is possible to bond without compromising stretchability and flexibility.
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basic information
"Dot coating" is a process that involves coating a substrate with hot melt or similar materials in a dot pattern. The "hot melt dot coating" introduced in this document is a process that imparts thermal adhesion functionality. Processing width: up to 1350 mm Substrates with processing experience: woven fabrics, knitted fabrics, non-woven fabrics, films Other options are also available for consultation.
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Applications/Examples of results
We provide "hot melt dot coating" processing and products for various materials that require stretchability and flexibility, primarily focusing on woven products for apparel.
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Company information
Nittobo Advantex manufactures and develops products utilizing dot technology. In the field of adhesive interlinings, we develop and manufacture high-quality, high-performance products, and in recent years, we have been actively engaged in the development of sustainability products. The newly launched "D-ALIGN Dot Coating" as a functional processing technique is a unique processing technology cultivated through adhesive interlinings, capable of unlocking various possibilities such as enhancing material performance, quality, and even process improvements. Main features: - Ability to fix functional material powders exposed on the surface - Retention of substrate functionality (flexibility, breathability, sound insulation, stretchability, etc.) - Improved productivity in processes requiring adhesion and lamination.
![[Case Study] Contributing to the reduction of coating treatment costs and extending lifespan!](https://image.mono.ipros.com/public/product/image/04e/2000191480/IPROS3436193288777543378.jpg?w=280&h=280)
![[Example] Preventing metal migration due to moisture in multilayer printed circuit boards.](https://image.mono.ipros.com/public/product/image/984/2000640006/IPROS21370121225881087240.jpeg?w=280&h=280)
