Coating method to maximize the potential of functional particles.
Please feel free to contact us at i-kaihatsu@nittobogrp.com. "Double Dot Coating" is a processing method that allows functional particles to adhere to the substrate while being exposed on the surface. This method enables the functional particles to demonstrate their performance more effectively than when mixed with binders and other materials. We welcome proposals for collaboration from companies that possess functional particles, as well as those considering enhancing the functionality of existing materials.
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basic information
"Double Dot Coating" After applying a binder in dot form on the substrate, particles and powders are scattered and then heated and dried, allowing functional particles to be fixed in a state where they are exposed on the surface. Processing Achievements - Particle diameter: 30μm and above - Dot diameter: 50μm and above - Substrate: Woven fabric, knitted fabric, non-woven fabric, (film: testing level)
Price range
Delivery Time
※I will consult with you after confirming the materials used and the required functions.
Applications/Examples of results
- Example of Use Particle: Hot melt adhesive (100μm) Base material: Polyester fabric ➡ Can effectively bond compared to hot melt sheets and webs ➡ Can reduce the amount of adhesive applied ➡ Lightweight, cost reduction
Detailed information
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By placing particles on the binder applied to the substrate, it becomes possible for them to be exposed on the surface.
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This is an example using deodorizing particles. Higher deodorizing performance can be achieved compared to mixing them into a binder.
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Company information
Nittobo Advantex manufactures and develops products utilizing dot technology. In the field of adhesive interlinings, we develop and manufacture high-quality, high-performance products, and in recent years, we have been actively engaged in the development of sustainability products. The newly launched "D-ALIGN Dot Coating" as a functional processing technique is a unique processing technology cultivated through adhesive interlinings, capable of unlocking various possibilities such as enhancing material performance, quality, and even process improvements. Main features: - Ability to fix functional material powders exposed on the surface - Retention of substrate functionality (flexibility, breathability, sound insulation, stretchability, etc.) - Improved productivity in processes requiring adhesion and lamination.
![[Example] Preventing metal migration due to moisture in multilayer printed circuit boards.](https://image.mono.ipros.com/public/product/image/984/2000640006/IPROS21370121225881087240.jpeg?w=280&h=280)
