Precision processing solutions that achieve high accuracy, non-contact, and low damage for fine processing of high-hardness materials and semiconductor materials.
The combination of water jet and laser processing technology enables clean drilling, cutting, grooving, and surface processing with extremely minimal thermal impact. This device is an ultra-fine processing machine that achieves "high precision," "non-contact," and "low damage" processing required in the fields of semiconductors, electronic components, and precision instruments.
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basic information
【Features】 - Reduces thermal damage and burr generation with the power of water jets - Widely compatible with brittle materials, high-hardness materials, and difficult-to-cut materials such as ceramics and diamonds - Minimizes cutting allowance to reduce material loss - Enables precision machining even on deep or uneven workpieces - Prevents slag adhesion with the cleaning power of high-pressure water, achieving smooth cutting surfaces
Price information
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Applications/Examples of results
■Semiconductor Manufacturing: Fine processing of SiC wafers and GaN wafers, scribing and cutting ■High Hardness Material Processing: Shaping of carbide tools, SUS materials, and diamonds; fine hole drilling ■Composite Material Processing: Deburring, thin film removal ■Electronic Components and Solar Cells: Cutting processing, scribing
Company information
At Sugino Machine, we uphold the spirit inherited since our founding in 1936 of "thinking for ourselves, creating for ourselves, and selling and servicing for ourselves." Utilizing our advanced technologies in "cutting, grinding, washing, polishing, crushing, and loosening," we continue to provide surprises and excitement that exceed our customers' expectations.
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