By using heat reflection and laser technology, LIT narrows down the heat generation points beneath the metal layer, which were difficult to detect, to as small as 2μm, breaking through the limits of heat generation analysis.
TD Imaging is a new heat generation analysis method that uses a laser scanning thermal reflection technique developed and patented by Hamamatsu Photonics. Compared to a 1300nm near-infrared laser, a 670nm short-wavelength laser achieves over four times the S/N ratio on metal surfaces such as copper and aluminum. Furthermore, it can pinpoint heat generation locations down to 2μm, making it possible to identify defects beneath metal layers, which was difficult with conventional LIT. Additionally, by combining it with LIT, which excels in wide-area detection, the accuracy and efficiency of the entire analysis flow from electrical failure analysis (EFA) to physical failure analysis (PFA) are dramatically enhanced.
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Item: Content Measurement Method: Laser Thermoreflectance Narrowing Accuracy: Approximately 2μm Wavelength Used: 670nm (other wavelengths can also be selected) Measurement Time: Approximately 90 seconds (fastest for full field of view) Compatible Devices: PHEMOS-X / Dual PHEMOS-X (can also be adapted for iPHEMOS-MPX with modifications)
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It will improve the success rate of identifying defect locations in advanced semiconductor devices, where 3D structuring and miniaturization of semiconductors for generative AI are progressing.
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