Heater [Case Study Related to Semiconductor Manufacturing Equipment]

Contributed to securing space inside the device! A case where there was also more room for wiring and wiring design of other parts.

We would like to introduce a case study of the implementation of a "cooling plate" for semiconductor manufacturing equipment manufacturers. The company required a space-saving design for the cooling plates incorporated into semiconductor manufacturing equipment. In response to this challenge, we proposed a manufacturing method using the "rivet method" as an alternative to the casting method, which allowed us to reduce the thickness of the cooling plates while maintaining cooling performance equivalent to that of conventional designs. 【Case Overview】 ■Challenge: Structural constraints due to space-saving requirements ■Solution: Proposal for space-saving and lightweight design using the rivet method ■Effect: Achieving optimization of internal space and maintenance of performance *For more details, please download the PDF or feel free to contact us.

Cooling Equipment