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  6. Specification verification and failure analysis through reliability testing.

Specification verification and failure analysis through reliability testing.

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last updated:Jul 04, 2025

アイテス
アイテス
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Analysis can be performed on samples in various conditions thanks to our unique preprocessing technology!

Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure points using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure points using TEM *For more details, please download the PDF or feel free to contact us.

    Contract AnalysisOther Testing Contract
I-V

Specification verification and failure analysis through reliability testing.

I-V after ESD.png
I-V after ESD.png Identifying defective parts_EMS.png Fault location_TEM.png
  • Related Link - https://www.ites.co.jp/
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Specification verification and failure analysis through reliability testing.

Specification verification and failure analysis through reliability testing.

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Total solutions for the reliability of semiconductor products.

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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

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OBIRCH analysis of SiC devices using short-wavelength lasers.

OBIRCH analysis of SiC devices using short-wavelength lasers.

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Backside light emission analysis of SiC devices

Backside light emission analysis of SiC devices

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Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

Observation of the diffusion layer of SiC MOSFET using LV-SEM and EBIC methods.

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Announcement of the Introduction of FIB-SEM Helios 5 UC

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Reverse bias test of power devices (up to 2000V)

Reverse bias test of power devices (up to 2000V)

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IOL testing of discrete semiconductors

IOL testing of discrete semiconductors

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Power device failure location / Slice & View three-dimensional reconstruction

Power device failure location / Slice & View three-dimensional reconstruction

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Specification verification and failure analysis through reliability testing.

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Our company conducts consistent analysis from reliability testing to failure analysis. This allows us to confirm whether the samples meet the specifications, as well as to identify and observe the defective areas of failed samples. We propose and implement tests and analyses tailored to our customers' requests and objectives, assisting from cause investigation to problem resolution. Please feel free to contact us when you need our services. 【Analysis Flow】 ■ Specification confirmation of semiconductor devices through reliability testing ■ Identification of defective areas and observation of failure locations using TEM ・ Identification of defective areas through EMS/OBIRCH analysis ・ Observation of failure locations using TEM

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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