[Production Example] Carbide Cutter for Semiconductor Film

We will introduce a case where the material was upgraded to ultra-fine particle alloy and the blade angle was adjusted to suit the application!

We received a request from a semiconductor manufacturer and would like to introduce a case where we produced and delivered small cutter blades for the film cutting application of semiconductor wafers. Due to durability issues with the existing blades, we upgraded the material to ultra-fine particle alloy and adjusted the blade angle to suit the application. Our company offers a variety of carbide cutters. If you could provide us with the main applications and mounting dimensions, we will take care of the detailed selection. 【Case Overview】 ■ Purpose: Film cutting of semiconductor wafers ■ Challenge: Durability issues with existing blades ■ Processing details: Material upgrade to ultra-fine particle alloy and adjustment of blade angle suitable for the application *For more details, please download the PDF or feel free to contact us.

Cutter/Scissors