Machining Case Study | Ring Parts for S45C Quenched and Tempered Semiconductor Manufacturing Equipment
Processing S45C quenched and tempered steel using high-precision CNC machining technology. Manufacturing ring components for semiconductor manufacturing equipment.
We would like to introduce a machining case of ring parts for semiconductor manufacturing equipment. By finishing the S45C quenched material into a complex and three-dimensional shape with high precision, we achieve both functionality and durability within the equipment. The product size is Φ305× overall thickness of 2mm. The design incorporates numerous cutouts and stepped machining to avoid interference with wiring and cooling systems. Even with shapes that boast high machining difficulty, we maintain high reproducibility and quality through a 5-axis machining center and precision jigs. [Case Overview] ■ Industry: Semiconductor manufacturing equipment ■ Machining method and process: High-precision CNC cutting ■ Product size: Φ305× overall thickness of 2mm ■ Material: S45C quenched *If you are wondering whether such machining is possible, please feel free to contact us. ~ For complex machining of intricate shapes using NC lathes and machining centers, contact Ootone Seiki ~
Inquire About This Product
basic information
For more details, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please feel free to contact us.
catalog(4)
Download All CatalogsCompany information
Daitokone Seiki Co., Ltd. specializes in precision machining. We are particularly skilled in round-shaped components and excel in the manufacturing of complex processed products that require multiple processes, primarily using NC lathes in conjunction with machining centers. Materials we can process include difficult-to-machine materials such as stainless steel, titanium, copper, and Inconel. Please feel free to inquire regardless of your industry. Since our establishment as a lathe machining company, we have consistently focused on quality and are actively challenging requests for micron-level precision (1/1000mm). We can process up to φ500 in diameter and 600 in length.