Cutting Process Example | High-Precision Ring Parts for SUS304 Semiconductor Manufacturing Equipment

Using SUS304 stainless steel and utilizing NC lathes, machining centers, and cylindrical grinding, we manufacture high-precision ring components for semiconductor manufacturing equipment.

We would like to introduce a case study of high-precision ring parts for semiconductor manufacturing equipment, which require nano-level accuracy. Using SUS304 stainless steel and our unique processing technology, we ensure high precision in roundness (within 0.010mm) and flatness required for rotating bodies. At our company, we combine advanced NC lathes, 3-axis and 4-axis machining centers with skilled operator techniques to provide stable quality without accuracy fluctuations even in repeat processing. 【Case Overview】 ■ Industry: Semiconductor manufacturing equipment ■ Processing methods and processes: Utilizing NC lathes, machining centers, cylindrical grinding, etc. ■ Product size: φ220×50mm ■ Lot size: 1 to 10 pieces If you are facing challenges such as "Can this kind of processing be done...?", please feel free to contact us. ~ For complex processing combining NC lathes and machining centers, turn to Ootone Seiki ~

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