Soft, strong, and connects heat. Next-generation electronics encapsulation material.
BD-4747 thermal conductive silicone gel is a two-component, addition reaction type silicone sealant that achieves a high level of "flexibility," "reliability," and "thermal control performance" required for next-generation electronic devices. Its low viscosity design provides excellent flowability and self-leveling properties, allowing it to smoothly penetrate fine gaps and cure uniformly while suppressing bubble formation. It is compatible with both room temperature and heat curing, enabling flexible adjustment of working time. After curing, it retains a soft, adhesive gel-like consistency and adheres widely to resin materials such as PC and ABS, as well as metal surfaces. Furthermore, it boasts a thermal conductivity of 0.7 to 0.8 W/m·K and flame retardancy compliant with UL 94V-0, along with excellent electrical insulation, waterproofing, heat and cold resistance, and weather resistance. It is also compliant with RoHS and REACH, making it an environmentally conscious development product. Applications include thermal control and sealing for power modules, IC chips, LED assemblies, solar power connection boxes, and automotive electronic components. It demonstrates its capabilities in environments that demand cutting-edge reliability.
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basic information
Before curing Chemical type: Silicone-based Appearance: Component A: White liquid Component B: Black liquid Viscosity: Component A: 4000–5000 mPa·s Component B: 1000–2000 mPa·s Post-mixing viscosity: 2000–3000 mPa·s Density: 1.62±0.05 g/cm³ Mixing ratio (weight ratio): 1:1 Pot life: Over 40 minutes After curing Thermal conductivity: 0.7–0.8 W/m·K Volume resistivity: ≥1.0×10¹⁴ Ω·cm Peel strength (aluminum substrate): >0.6 lbf/in Flame retardancy rating: UL94 V-0 Operating temperature range: -60℃ to 200℃
Price range
P1
Delivery Time
Applications/Examples of results
Power modules, IC chips, LED assembly, solar power connection boxes, automotive electronic components, etc.
Detailed information
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【Instructions for Use】 1. Surface Cleaning: Remove oil and dirt from the surface of the LED board and heat sink using alcohol or similar substances. 2. Application of Silicone Gel: Use a syringe or spatula to apply an appropriate amount of silicone gel to the heat dissipation areas around the LED chip. 3. Assembly: Attach the board with the applied gel to the heat dissipation structure, such as a heat sink, and secure it with screws or by crimping. 4. Initial Curing (if necessary): Allow to cure at room temperature or with heat. (For detailed conditions, please refer to the instruction manual.) Thank you for your reference.
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Company information
We handle outstanding products in three main categories: graphene resins, specialty pigments, and electronic components. These products are manufactured under the latest technology and strict quality control, carefully selected to meet the diverse needs of the industry. Furthermore, we also offer consulting services, providing expert advice and support regarding chemical products. We keep abreast of industry trends and the latest technological information to propose optimal solutions that meet our customers' business needs. Our mission is to provide new value to our customers' businesses through innovative chemical products. Graphene resins possess lightweight and robust characteristics, with applications expected in many advanced industries. Specialty pigments combine vibrant colors and durability, enhancing the added value of products. Electronic components are renowned for their reliability and high performance, making them essential for the latest electronic devices. Royal Bridge LLC prioritizes building trust with our customers and strives for prompt and flexible responses. By leveraging our expertise and unique network, we aim to provide optimal solutions and build a partnership that continues to grow together.
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