EMS service support
Merits: 1. Flexibility 2. Small-batch production of various types
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basic information
The production line equipment includes major Japanese companies such as Juki and Omron. • Maximum board size: 410cm x 330cm x 2.5cm (length) x (width) x (thickness) • Minimum board size: 5cm x 5cm x 2.5cm (length) x (width) x (thickness) • Minimum component size: 0201*1 ~ □74mm/50*150mm • Minimum IC pitch: 0.2mm minimum / 2.54mm maximum • BGA pitch: 0.25mm minimum / 3mm maximum • BGA diameter: 0.1mm • Lead-free process • Single-sided and double-sided work
Price range
Delivery Time
Applications/Examples of results
Various substrate mounting
Company information
The main business is divided into three parts. 1. Design, development, manufacturing, and sales of display module products such as COG, COB, COF, TAB, OLED, and TFT. The lineup includes over 300 items, including custom products, to meet various needs. 2. OCA optical bonding OEM services offer two types of processes: atmospheric and vacuum bonding. Equipment can handle bonding up to 27 inches. 3. We have an SMT production line, providing a one-stop manufacturing service (EMS) from component mounting to board assembly and inspection. We also offer OEM services focused solely on mounting, enabling small-batch production with a variety of products and short lead times. Our belief is to provide "the only satisfactory service to our customers." We will continue to strive for ongoing operation and improvement, aiming to be a company that earns even greater trust from our customers.
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