Negative resist material for lift-off process "SA Series"
Negative resist material for lift-off process "SA Series"
It is an acrylic negative photoresist material suitable for wiring formation using lift-off processes, capable of producing inverted taper shapes and hole patterns.
The "SA Series" is a negative-type resist material that can form an inverse taper shape and hole patterns with the following characteristics: This material is suitable for wiring formation using a lift-off process. ■ Capable of forming thick films: ≦ 20 μm ■ High sensitivity: ≧ 60 mJ/cm² ■ High heat resistance: ≦ 130℃ ■ Can be removed with organic solvents at room temperature *Please feel free to contact us if you have any requests.
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It can be used in the lift-off process.
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Company information
Osaka Organic Chemical Industry Co., Ltd. provides various resin materials that support daily life, based on acrylic acid esters. Our main product, acrylic acid esters, is used as a resin material in a wide range of industrial fields, including paints, inks, adhesives, and electronic materials. Additionally, by utilizing "surface modification and arrangement control" and "high purity" technologies, we are creating new functions and working to expand into new business areas. Moving forward, as a research and development-oriented company, we will continue to offer attractive new products to our customers.
