The standard measuring device for flow solder bath management has undergone a model change! It achieves more advanced management with USB communication and profile measurement functions.
The DS-11 is a dip tester that allows for measurement by simply placing the necessary information for managing flow soldering equipment on a conveyor. It comes with a cooling stand that enables quick cooling of the device and can also be used as a stand to protect the sensors. Additionally, we offer a heat-resistant cover as an option that can accommodate high thermal loads, such as preheaters. Please feel free to contact us if you need it. 【Features】 ■ USB connection allows for the use of the included software to determine and manage measurement results. ■ Temperature profile measurement function enables monitoring of temperature profiles with 0.1-second sampling from preheat and solder temperature sensors. ■ An optional heat-resistant cover is available to accommodate high thermal loads, such as preheaters. ■ A stand is included to cool and protect the sensor part after measurement. *For more details, please download the PDF or feel free to contact us.
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【Measurement Data Specifications (Partial)】 ■ Surface Temperature of the Bottom Side of the Substrate ・Sensor: K-type Thermocouple ・Measurement Range: 0 to 300℃ ・Accuracy: ±1℃ ■ Solder Temperature ・Sensor: CA Sheath Thermocouple ・Measurement Range: 0 to 300℃ ・Accuracy: ±1℃ ■ Dip Time ・Sensor: Electrodes (4 locations) ・Measurement Range: 0 to 10.0 seconds ・Accuracy: ±0.2℃ *For more details, please download the PDF or feel free to contact us.
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【Purpose】 ■Management of flow soldering equipment *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
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