The possibilities of next-generation structural design expanding with 3D printing of SiC.

Realizing complex shapes without constraints. The innovation of silicon carbide opens up new value from aerospace to semiconductors.

Silicon carbide "IntrinSiC" is a next-generation solution that combines silicon infiltration and reactive bonding type SiC (RBSiC) with 3D printing. It enables the production of complex and large integrated shapes that were previously difficult to achieve, realizing new structural designs in fields such as heat treatment equipment, optical devices, and solar thermal power generation. 【Features】 ■ Manufacturing of integrated and complex shapes in a single process ■ High-precision finishing through lapping, grinding, and polishing ■ Existing products can be redesigned using non-contact measurement ■ Supports the digitization of evaluation data *For more details, please refer to the product catalog available for download as a PDF. *Feel free to contact us with any inquiries.

Other machine elementsComposite MaterialsCeramics