A clip-on folding plate clamp that allows for module installation and grounding with just one bolt.
With a single bolt, you can secure the latch, fix the module, and establish grounding. The pitch between modules is only 5mm. Since the fixing of the latch and the fixing of the module, which are usually separate processes, can be done with one bolt, the effort required for module fixing has been halved. Additionally, grounding work is also completed during the module fixing process. 【Features】 ■ Lightweight ■ Maintenance ■ Expanded roof compatibility ■ Safety ■ Unique Z-grounding structure ■ Aesthetic design
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【Specifications】 ■Installation Location: Haze-type folded plate roof ■Main Material: Aluminum + Anodized Finish ■Tensile Strength: 2000N ■Compressive Strength: 4000N ■Shear Strength: 300N ■Can be installed in areas with heavy salt damage (installation in locations directly exposed to seawater splashes is not allowed) *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Company information
Mori Electronics Industry Co., Ltd. was established in 1966 as a subsidiary of Shindengen Electric Manufacturing Co., Ltd. Since then, we have worked as a specialized trading company connecting customers and manufacturers, striving for the stable supply of not only semiconductors but also electronic components and devices. In order to respond to the increasingly growing market needs, we aim to provide total solution services with meticulous sales and marketing capabilities. As corporate social responsibility (CSR) has become a constant topic of discussion, what is now required of companies is not just to make production activities efficient. To fulfill corporate responsibilities towards the environment, including measures against global warming and the effective use of energy resources, Mori Electronics Industry will continue to challenge itself with gratitude in our hearts, aiming to become a next-generation value-creating trading company.
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