It is possible to reduce the risk of damage to mounted components because the mounting substrate can be cut with low stress.
This is a device that divides a large number of small, complex-shaped circuit boards using a router method. It cuts away unnecessary parts of the complex shapes of printed circuit boards after assembly using a router bit. Since it can cut printed circuit boards with low stress, it reduces the risk of damage to mounted components (such as multilayer ceramic capacitors) caused by stress in conventional hand-breaking or pressing methods. The board division with a single cut using a router bit results in no burrs, and the cut surface is clean, eliminating the need for sanding or similar processes. *Please consult us as there are certain conditions for application. The created cutting programs are centrally managed on a server, allowing for the switching of multiple programs. It connects to higher-level production systems and supports data collection (operating time, start and end times of division, equipment abnormality information, router bit lifespan management, etc.) (e-F@ctory compatible). By widening the opening width of the device's access door, setup efficiency is improved. By incorporating a dust collector into the bottom of the device, space-saving is achieved. The acceleration of the X-Y axis movement speed (three times compared to our conventional models) significantly improves productivity. The Z-axis position can be set for each cutting point, allowing for a reduction in takt time.
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basic information
Item: MR2535H2 Maximum substrate size (length × width): 250mm × 350mm, compatible with M size substrates *Please consult for L size substrates Substrate material: Glass epoxy (FR-4), resin substrates such as CEM-3 Board thickness: 0.4–2.0mm Positioning method: Positioning using jigs X-Y axis positioning method: 2-axis AC servo control Maximum cutting speed reference value (at spindle 50,000rpm): 100mm/s (router diameter ø3.0mm, board thickness t=0.4mm) (recommended continuous use value: 20mm/s or less) X-Y axis movement speed: Maximum 1,200mm/s Repeat positioning accuracy: ±0.01mm Z-axis specifications: AC servo drive, 100mm stroke Collet size: ø3.175mm (1/8 inch) Router: Can mount ø0.8–3.0mm / Use router bits in multiple stages to reduce running costs Spindle allowable rotational speed: 60,000rpm (recommended continuous use below 50,000rpm) Standard specifications: Bit ejection and breakage detection function, built-in compact dust collector Device external dimensions (approximate): 790W × 1140D × 1670H (including touch panel, excluding indicator lights) Device approximate weight: About 400kg
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Applications/Examples of results
Model for low-volume production of multiple varieties.
Company information
In 1979, we established Tokyo Machine and Tool Co., Ltd. with the aim of selling tools and consumables for drilling machines used in printed circuit board processing to meet customer needs. The precision and density required for product substrates have further advanced, and there is a wide range of peripheral equipment such as exposure devices and inspection instruments. Our company aims to offer a product lineup that can propose solutions for the entire process, from material input to product inspection, not just limited to the drilling process of printed circuit boards. We have also established sales bases in Thailand and Vietnam, aiming for global sales that meet customer needs.
