3D AOI Device for PCB Assembly MV-7 OMNI

basic information

- Principles and Applications of 3D Measurement Moire fringes are projected from a projector onto the component being implemented, and the reflected light is captured by a camera. The height of the component can be measured from the phase shift of that light (Reflective Phase Shift Moire Method). Utilizing this principle, the heights of components and IC leads are measured. Inspections for component lift, IC lead lift, and missing parts are conducted based on the differences in height. This significantly improves defect detection capability compared to conventional 2D inspections, thereby reducing the excessive detection issues that were challenges in 2D inspections. - Inspection Items Where Defect Detection Capability is Enhanced in 3D (Height) Lift of IC leads Lift and tilt of chip components and other parts Presence or absence of components (missing parts inspection) - Improvement of Moire Projected Light for More Accurate 3D Information Acquisition Height inspection of mirror-like components and glass materials, as well as stable height inspection of solder fillets, has been achieved. - Enhancement of Defect Detection Capability through 8-Stage Color Lighting By illuminating the substrate with five colors of LEDs at eight different angles, defective areas are highlighted, improving defect detection capability. In particular, the realization of completely coaxial illumination allows for effective inspection of component polarity, character inspection, component matching, and 2D inspection of solder fillets without being affected by adjacent tall components such as electrolytic capacitors.

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3D AOI device for substrate assembly