[Analysis Case] Investigation of Foreign Object Occurrence: Analysis of the Tube
It is possible to estimate the cause of wafer contamination!
TOF-SIMS is a very effective method for investigating the causes of contamination due to foreign substances, deposits, dirt, discoloration, and other factors related to the process. By comparing the mass spectral information obtained from contamination such as foreign substances with the mass spectral information of candidate contamination source components, it is possible to infer the sources of that contamination. In this document, we prepared four types of resin tubes used in the wafer manufacturing process and foreign substances on Si wafers, and by comparing their mass spectral information, we evaluated which components used in the process the contamination from the foreign substances was attributed to.
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basic information
Measurement method: TOF-SIMS Product fields: Electronic components, manufacturing equipment and parts, daily necessities Analysis purpose: Impurity evaluation and distribution assessment
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Analysis of electronic components, manufacturing equipment and parts, and daily necessities.
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Company information
MST is a foundation that provides contract analysis services. We possess various analytical instruments such as TEM, SIMS, and XRD to meet your analysis needs. Our knowledgeable sales representatives will propose appropriate analysis plans. We are also available for consultations at your company, of course. We have obtained ISO 9001 and ISO 27001 certifications. Please feel free to consult us for product development, identifying causes of defects, and patent investigations! MST will guide you to solutions for your "troubles"!