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  6. Silicon wafer grinding process

Silicon wafer grinding process

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last updated:Nov 11, 2025

ブル精密 (株)ブル精密 本社
ブル精密 (株)ブル精密 本社
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Silicon wafer grinding processing

Silicon wafer grinding processing Outer diameter 90 mm Grinding of holes with diameters of φ36 mm and φ18 mm Chamfering on the top and bottom surfaces Produced as a prototype.

    Wafer
20251023_144035.jpg

Silicon wafer grinding process

20251023_144035.jpg
20251023_144035.jpg
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basic information

Silicon wafer It is composed of pure silicon and has very stable electronic properties. It has excellent conductivity and thermal stability, making it an essential substrate for semiconductor manufacturing. It is used in semiconductor devices, solar cells, sensors, LEDs, and MEMS devices, among others.

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ブル精密

ブル精密 (株)ブル精密 本社

Glass and clay products

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Since our establishment in 1985, our company has been committed to "all kinds of glass processing," and we have been supported by our customers for over 30 years. Please leave to us any processing that is impossible or not cost-effective for other companies! With the motto of "smiles and perseverance," we strive to meet our customers' needs, advancing each day as our company name suggests. The new president is in his 40s and is taking on projects that have been passed around various companies to improve technical skills, repeatedly engaging in trial and error to steadily build up expertise day by day. Additionally, we are now offering free prototype production. If you are struggling with mass production prototypes, please consult with us. We look forward to hearing from you!

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