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  3. Measurement and Analysis
  4. Inspection Equipment and Devices
  5. probe
  6. Contact probe

Contact probe

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last updated:Dec 16, 2025

ウィル 本社
ウィル 本社
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Support for micro-machining at the φ0.05 level! A consistent manufacturing system from high-precision machining to surface treatment.

The "contact probe" is a component used for probe pins in the electrical inspection process of semiconductor wafers and IC packages. It achieves stable processing accuracy even with extremely small diameters and short dimensions, making it suitable for fine electrodes and precision contact parts. It balances short delivery times and quality stability through in-house completion, minimizing variations between processes. Additionally, it ensures both signal stability and durability through heat treatment and various plating processes (Ni-P, Au, AuCo, Pd, Rh), achieving contact reliability and long lifespan in high-frequency and microcurrent measurements. 【Features】 - Supports precision cutting processing from a material diameter of φ0.6mm - Numerous manufacturing achievements for fine parts with a minimum processing diameter of φ0.05 and a total length of less than 1mm - Drilling processing can accommodate a minimum diameter of φ0.1 - Thickness specifications can be accommodated for various platings such as Ni-P, Au, PdCo, and Rh, and heat treatment is also supported - A comprehensive in-house system from high-precision processing to surface treatment - By collaborating with our inspection company located overseas, we have established a high-quality system that meets global quality standards *For more details, please feel free to contact us.

    probe
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Contact probe

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画像1.png プローブ指.jpg
  • Related Link - https://www.will-mfg.com/
  • Special site - Product/service details - https://pr.mono.ipros.com/will-mfg/product/

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【Specifications】 ■ Material compatibility: Brass, beryllium copper, SK material, phosphor bronze, and other alloys ■ Machining: Supports high-precision cutting (minimum machining diameter φ0.05, fine parts with a total length of 1mm or less) ■ Hole processing: Capable of handling minimum hole diameter φ0.1 ■ Surface treatment: Supports various plating treatments such as Ni-P, Au, AuCo, Pd, Rh, etc. Can be combined with heat treatment *For more details, please feel free to contact us.

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Applications/Examples of results

【Usage】 ■ Electrical testing in semiconductor manufacturing processes ■ Components of test sockets and probe guards ■ Capable of precise measurement of high-frequency signals and small currents *For more details, please feel free to contact us.

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Case study of microfabrication for semiconductor electrical inspection contact probe components | ±0.005mm high precision, mass production compatible

Case study of microfabrication for semiconductor electrical inspection contact probe components | ±0.005mm high precision, mass production compatible

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Examples of fine small-diameter screw machining | Compatible with M1.4×0.25; precision cutting of SUS303/304/316

Examples of fine small-diameter screw machining | Compatible with M1.4×0.25; precision cutting of SUS303/304/316

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Company information

ウィル

ウィル 本社

Manufacturing and processing contract

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Located in the ancient capital of Japan, Kyoto, Will Corporation manufactures extremely fine precision machined parts using NC lathes, with a production scale reaching tens of millions of parts per month. We provide high-quality, short-lead-time delivery of high-difficulty, high-precision parts tailored to our customers' needs. Our parts are actively used in many markets around the world (Asia, Europe, North America), including electronic components, medical parts, automotive parts, and hydraulic parts.

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