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  6. Industrial Projector for Electronic Devices | Structured Light Patterns and 3D Measurement

Industrial Projector for Electronic Devices | Structured Light Patterns and 3D Measurement

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last updated:Mar 26, 2026

Japan Bopixel Co., Ltd.
Japan Bopixel Co., Ltd.
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Industrial DLP projectors that achieve high-precision 3D inspection.

In the electronic equipment industry, circuit board inspection requires high-precision testing to ensure product quality and reliability. It is particularly important to accurately detect the mounting condition of fine components and soldering defects. Traditional inspection methods have limitations in detection accuracy and inspection speed, making efficient inspection challenging. The DLP projector [OPR series] addresses these issues by enabling high-precision 3D inspection. [Application Scenarios] - Inspection of circuit board mounting conditions - Detection of soldering defects - Inspection of component defects [Benefits of Implementation] - Quality improvement through high-precision inspection - Reduction in inspection time - Cost savings through early detection of defective products

    Other image-related equipment
OPR-SERIES.png

Industrial Projector for Electronic Devices | Structured Light Patterns and 3D Measurement

OPR-SERIES.png
OPR-SERIES.png OPR305-single.png OPR405-single.png OPR407-single.png
  • Related Link - https://bopixel.co.jp/dlpprojector-2/
  • Special site - Product/service details - https://pr.mono.ipros.com/bopixel/product/

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basic information

【Features】 - Supports high-speed and high-precision 3D inspection for applications such as 3D measurement, appearance inspection, and medical image processing. - Compact size for easy integration. - A wide range of models including Full HD and RGB models, C-mount specifications, and optical designs optimized for angled projection. - Capable of extensive and high-precision projection as well as high-speed inspection. - Sophisticated optical and structural design minimizes thermal deformation, ensuring high-quality projection effects. 【Our Strengths】 We design, develop, manufacture, and sell high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. We actively adopt next-generation key devices to achieve low power consumption and low heat generation.

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Applications/Examples of results

3D measurement, 3D scanning, appearance inspection of parts/circuit boards, medical image processing, and other industrial image processing focused on semiconductors and electronics.

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Model number overview
OPR305100 Action distance (TYP): 100 / Projection area (mm): 24.3×13.7 / Projection accuracy (µm): 19 / Projection mode: Direct projection / Light source: Blue
OPR305120 Operating distance (TYP): 120 / Projection area (mm): 60.4×34 / Projection accuracy (µm): 47 / Projection mode: Orthographic / Light source: Blue
OPR305185 Action distance (TYP): 185 / Projection area (mm): 136×77 / Projection accuracy (µm): 106 / Projection mode: Direct projection / Light source: Blue
OPR305120S Action distance (TYP): 120 / Projection area (mm): 37×69×29 / Projection accuracy (µm): 40-51 / Projection mode: oblique projection (30°) / Light source: Blue
OPR305120S-K Action distance (TYP): 120 / Projection area (mm): 37×69×29 / Projection accuracy (µm): 40-51 / Projection mode: oblique projection (30°) / Light source: Blue / Case model
OPR305185S-25 Operating distance (TYP): 185 / Projection area (mm): 91×154×63 / Projection accuracy (µm): 90-122 / Projection mode: oblique projection (25°) / Light source: Blue
OPR305185S-25-K Operating distance (TYP): 185 / Projection area (mm): 91×154×63 / Projection accuracy (µm): 90-122 / Projection mode: oblique projection (25°) / Light source: Blue / Case model
OPR305185S-30 Action distance (TYP): 185 / Projection area (mm): 91×154×63 / Projection accuracy (µm): 88-126 / Projection mode: Oblique projection (30°) / Light source: Blue
OPR405200 Operating Distance (TYP): 2000 / Projection Area (mm): 1667×1042 / Projection Accuracy (µm): 914 / Projection Mode: Direct Projection / Light Source: RGB (300lm)
OPR405200X Action distance (TYP): 2000 / Projection area (mm): 1667×1042 / Projection accuracy (µm): 914 / Projection mode: Offset 100% / Light source: RGB (450lm)
OPR407200 Operating Distance (TYP): 2000 / Projection Area (mm): 1667×938 / Projection Accuracy (µm): 868 / Projection Mode: Direct Projection / Light Source: RGB (600lm)
OPR407700 Operating Distance (TYP): 700 / Projection Area (mm): 604×340 / Projection Accuracy (µm): 315 / Projection Mode: Direct Projection / Light Source: RGB (280lm)
OPR407180 Operating distance (TYP): 180 / Projection area (mm): 81×46 / Projection accuracy (µm): 42 / Projection mode: Direct projection / Light source: Blue (1.5W) or White (180lm)
OPR407180S Operating Distance (TYP): 180 / Projection Area (mm): 85×52×75 / Projection Accuracy (µm): 39-44 / Projection Mode: Oblique Projection (30°) / Light Source: Blue (1W) or White (120lm)
OPR407C Operating distance (TYP): 90-285 / Projection area (mm): 18×11 to 53×30 / Projection accuracy (µm): 42 / Projection mode: Direct projection / Light source: Blue (1.5W) or White (180lm)

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Company information

Japan

Japan Bopixel Co., Ltd.

Industrial Electrical Equipment

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We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.

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