Improving uniformity with ultrasonic powder sieves for pharmaceuticals.
Artec ultrasonic sieve DGS 35kHz, ultrasonic hopper FS 35kHz (Flowsonic)
Solving the challenges of powder screening processes! Enhancing uniformity and contributing to the improvement of quality in pharmaceutical manufacturing.
In the pharmaceutical industry, the uniformity of powders is extremely important to ensure the quality and safety of products. In particular, the uneven distribution of active ingredients can affect the efficacy of the product and potentially harm patients' health. An ultrasonic powder sifter solves issues such as clogging, adhesion, and agglomeration in the powder sifting process, achieving a high degree of uniformity in powders. This contributes to the improvement of pharmaceutical quality. 【Application Scenarios】 * Manufacturing of pharmaceutical raw materials * Formulation of excipients * Production of granules and powdered pharmaceuticals 【Effects of Implementation】 * Improved powder uniformity * Suppression of active ingredient unevenness * Stabilization of product quality
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basic information
【Features】 * Achieves dry sieving in high mesh such as 20μm opening * Compatible with standard JIS mesh frames from Φ75 to Φ400 with quick-release clamps * Measures against surface adhesion, bridging, rat holes, and improved discharge capacity using ultrasonic hoppers * Removal of foreign substances and disintegration through ultrasonic sieving at the hopper discharge, resulting in fluffy powder advantageous for transport in the next process * Allows for coordinated management with electronic scales through quantitative supply transport using ultrasonic vibrations 【Our Strengths】 UC Technology has been leading ultrasonic technology since 1966, contributing to solving customer challenges. We have established a wide range of support systems, from experimental responses and demo equipment loans to ultrasonic consulting.
Price information
The loan evaluation of the demo unit is usually provided free of charge for two days. For evaluations of demo units lasting more than a week, please consult us. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.
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Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for countermeasures against mesh clogging caused by powder adhesion and handling issues in powder transport environments. It has been adopted in various stages from raw material development to mass production, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products and more. *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year, the Powder Technology Exhibition will be held in Osaka. We look forward to seeing you all there. Our sales engineers will be available at the venue to discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Technology Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
