Ultrasonic powder sieve, 2-day free demo machine rental campaign! Download the manual!
Artec ultrasonic sieve DGS 35kHz, ultrasonic hopper FS 35kHz (Flowsonic)
Improvement of troubles such as clogging, adhesion, and agglomeration in the powder screening process, and for increasing yield and reducing time during powder screening! Be sure to consider the ultrasonic hopper!
The "Ultrasonic Sieve Unit" transmits special ultrasonic vibrations to each individual stainless steel mesh wire, resolving issues with sieve frames and hoppers (such as clogging, adhesion, and bridging). 【Features】 Improves classification efficiency in powder sieving processes and contributes to time savings! - Achieves dry sieving with high mesh sizes such as 20μm. - Compatible with standard JIS sieve frames from Φ75 to Φ400, allowing for one-touch installation with clamp-type fixtures. - The ultrasonic hopper addresses surface adhesion, bridging, rat-hole issues, and enhances discharge capacity. - Removes foreign substances through ultrasonic sieving at the hopper discharge outlet, and breaks down clumps into fluffy powders, which is advantageous for transport in the next process. - Enables coordinated management with electronic scales through quantitative supply transport using ultrasonic vibrations. - The ultrasonic sieve machine (two-stage) allows for even finer dry classification. Consulting services for ultrasonic vibration application are available. We also accept comparative verification with other equipment currently used or under consideration by customers. *For more details, please refer to the PDF materials and the product introduction video on YouTube. Feel free to contact us with any inquiries. Additionally, we will be exhibiting at the "International Powder Industry Exhibition Osaka" from October 15 to 17, 2025. We look forward to your visit.
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basic information
【Ultrasonic Oscillator (DGS Model) Specifications】 Operating Frequency Range: 30kHz to 38kHz, full mesh vibration through sweep oscillation! Maximum Output: 50W unit: Φ50 to Φ250, 100W unit: Φ300 to Φ400, Hopper/Shooter/Piping: 50 to 100W Power Supply: Single-phase 100V, 200V, 230V ±10% (50Hz/60Hz) multi-power supply built-in Weight: DGS model 3.4kg, FS model 3.2kg Dimensions: Height 170mm x Width 280mm x Depth 124mm Ambient Temperature: 0℃ to 45℃ (Humidity below 80% at 30℃) Safety Standards: CE, IP65 structure 【Ultrasonic Converter C35-SD8 Specifications】 Maximum Output: 120W (C35-SD8) Material: Titanium alloy body (C35-SD8) Weight: 270g 【Clamp Band Jig Specifications】 Material: SUS304 (Option SUS316L) Compatible with sizes: Φ50, Φ75, Φ100, Φ150, Φ200, Φ250, Φ300, Φ400, and other sizes 【Jig for Hopper/Shooter/Piping】 Material: SUS304 Waveguide rod: Φ14 bent rod to be welded to the side of the hopper, etc. For more details, please contact us.
Price information
The rental evaluation of the demo unit is usually provided free of charge for two days. If you need to evaluate the demo unit for more than a week, please consult us. Additionally, feel free to contact us for a quote on the complete set of ultrasonic units.
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Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for countermeasures against mesh clogging caused by powder adhesion and handling issues in powder transport environments. It has been adopted in various raw material developments to mass production environments, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products etc. *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year, the Powder Technology Exhibition will be held in Osaka. We look forward to seeing you all there. Our sales engineers will be available at the venue to discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Technology Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
catalog（2）
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.