From round and square frames to metal plates, measures against powder adhesion and clogging are possible! Achieve stable sieving even in explosion-proof and temperature-changing environments!
It is possible to apply ultrasonic vibrations to any metal shape. From round and square frames to metal plates (such as hoppers), it helps prevent powder adhesion and clogging, thereby improving classification efficiency. Since the converter and cables can be placed outside the powder supply area, stable ultrasonic sieving can be achieved even for powder characteristics that are sensitive to explosion, temperature changes, and cleaning. It is also compatible with applications such as ultrasonic mesh cleaning and powder transportation. *Please consult us for test and rental machines. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Ultrasonic Powder Sifter DGS】 - DGS High-Performance Model (Variable output, with I/O, PC software included, compatible with standard sieves from φ75 to production machines up to φ1000) It can apply stable ultrasonic micro-vibrations even to fine meshes such as SUS mesh with an opening of 20μm. The dedicated PC software allows for frequency analysis of the metal frame, enabling arbitrary setting of the optimal frequency, thus achieving effective mesh sifting vibrations. 【Ultrasonic Powder Sifter PNS】 - PNS Low-Cost Model (Compatible with standard sieves from φ75 to φ300) Similar to the DGS model, it can be used as a tabletop ultrasonic sifter simply by attaching a dedicated accessory to a general-purpose JIS standard sieve frame. *Please inquire about test and loan machines.
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Detailed information
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[Experimental Example] In the treated toner powder, the application of ultrasonic vibrations allows for the passage through the sieve in a short time without agglomeration or clogging. Surface of the mesh after ultrasonic sieving.
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[Experimental Example] In the treated toner powder, the application of ultrasonic vibrations allows for the passage through the sieve in a short time without agglomeration or clogging. Surface of the mesh after sieving without ultrasound.
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.