Ultrasonic Megasonic Cleaning Equipment for Semiconductor Wafers

We are pleased to announce that Tick Corporation has launched a product introduction page for the SONOSYS megasonic cleaning nozzle system. The megasonic cleaning technology from SONOSYS utilizes high-frequency energy ranging from 600 kHz to 9 MHz to precisely remove fine particles while minimizing damage to microstructures such as semiconductor wafers, photomasks, and MEMS. The new page features the characteristics of single, double, and triple nozzles, as well as applications for semiconductors, MEMS, optical components, and LCD/FPD substrates. If you are considering fine particle removal, precision cleaning using ultra-pure water (DI Water), or megasonic cleaning at frequencies such as 600 kHz or 1 MHz, please take a look.

We have updated the product leaflet for the SONOSYS megasonic cleaning device from Germany to the latest version. SONOSYS's megasonic cleaning technology is a non-contact precision cleaning technique that efficiently removes fine particles by transmitting high-frequency ultrasonic energy through liquids such as pure water (DI Water) to the surface of the target object. It is particularly suitable for the precision cleaning of products with fine structures, such as semiconductor wafers, photomasks, MEMS, various substrates, and optical components, and is utilized in various fields that require high cleanliness, starting with semiconductor manufacturing processes. SONOSYS offers a range of frequencies depending on the application and the particles to be removed, as well as a megasonic nozzle system that accommodates various cleaning conditions, including Single Nozzle, Dual Nozzle, and Triple Nozzle. Customers who have challenges such as "wanting to remove fine particles from wafers," "wanting to clean photomasks and MEMS while minimizing damage," or "wanting to review existing cleaning processes" are encouraged to take a look at the latest leaflet.